loadpatents
name:-0.0041031837463379
name:-0.0041470527648926
name:-0.0013761520385742
Piao; JinYu Patent Filings

Piao; JinYu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Piao; JinYu.The latest application filed is for "aqueous aluminum brazing composition".

Company Profile
0.3.3
  • Piao; JinYu - Kakogawa JP
  • PIAO; JinYu - Kakogawa-shi Hyogo
  • Piao; JinYu - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Aqueous aluminum brazing composition
Grant 10,252,377 - Ota , et al.
2019-04-09
Aqueous Aluminum Brazing Composition
App 20160052092 - OTA; Yasuo ;   et al.
2016-02-25
Solder alloy, solder paste, and electronic circuit board
Grant 9,221,129 - Imamura , et al. December 29, 2
2015-12-29
Solder alloy, solder paste, and electronic circuit board
Grant 9,221,132 - Imamura , et al. December 29, 2
2015-12-29
Solder Alloy, Solder Paste, And Electronic Circuit Board
App 20150183062 - Imamura; Yoji ;   et al.
2015-07-02
Solder Alloy, Solder Paste, And Electronic Circuit Board
App 20150136461 - Imamura; Yoji ;   et al.
2015-05-21

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