Phoenix Pioneer Technology Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Phoenix Pioneer Technology Co., Ltd..The latest application filed is for "manufacturing method for surface acoustic wave filter package structure".

Company Profile

29.105.88

Phoenix Pioneer Technology Co., Ltd. - Hsinchu County TW
PHOENIX PIONEER TECHNOLOGY CO., LTD. - Hukou Township N/A TW
PHOENIX PIONEER TECHNOLOGY CO., LTD - Hsinchu County N/A TW
PHOENIX PIONEER TECHNOLOGY CO., LTD. - Hsinchu County 303 TW
PHOENIX PIONEER TECHNOLOGY CO., LTD - Hsinchu County 303 TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Manufacturing Method For Surface Acoustic Wave Filter Package Structure App 20220302896 - Hsu; Shih-Ping ; et al.	2022-09-22
Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same Grant 11,450,597 - Chou , et al. September 20, 2	2022-09-20
Intermediate Substrate And Fabrication Method Thereof App 20220285257 - Hsu; Shih-Ping ; et al.	2022-09-08
Package structure Grant 11,417,581 - Hsu , et al. August 16, 2	2022-08-16
Inductor Structure And Fabrication Method Thereof, Electronic Package And Fabrication Method Thereof, And Method For Fabricating Packaging Carrier App 20220254869 - Hsu; Shih-Ping	2022-08-11
Semiconductor package carrier board, method for fabricating the same, and electronic package having the same Grant 11,404,348 - Chou , et al. August 2, 2	2022-08-02
Semiconductor Package Structure App 20220238425 - Hsu; Che-Wei ; et al.	2022-07-28
Surface acoustic wave filter package structure and method of manufacturing the same Grant 11,387,806 - Hsu , et al. July 12, 2	2022-07-12
Semiconductor Package Device App 20220173048 - Yu; Chun-Hsien ; et al.	2022-06-02
Semiconductor Package Structure And Manufacturing Method Thereof App 20220165674 - Hsu; Che-Wei	2022-05-26
Semiconductor package substrate, electronic package and methods for fabricating the same Grant 11,335,630 - Chou , et al. May 17, 2	2022-05-17
Semiconductor Package Structure And Manufacturing Method Thereof App 20220045025 - Hsu; Che-Wei	2022-02-10
Package apparatus Grant 11,246,223 - Hsu February 8, 2	2022-02-08
Package structure for semiconductor device and manufacturing method thereof Grant 11,222,880 - Hsu , et al. January 11, 2	2022-01-11
Flip-chip package substrate and method for fabricating the same Grant 11,183,447 - Chou , et al. November 23, 2	2021-11-23
Manufacturing Method For Semiconductor Package Structure App 20210320096 - Hu; Chu-Chin ; et al.	2021-10-14
Flip-chip package substrate and method for preparing the same Grant 11,139,230 - Chou , et al. October 5, 2	2021-10-05
Semiconductor Packaging Substrate, Fabrication Method And Packaging Process Thereof App 20210296260 - Chou; Pao-Hung ; et al.	2021-09-23
Package Substrate And Method For Manufacturing The Same App 20210296259 - YEN; You-Lung ; et al.	2021-09-23
Package substrate and flip-chip package circuit including the same Grant 11,081,435 - Hsu , et al. August 3, 2	2021-08-03
Package on package and a method of fabricating the same Grant 11,069,540 - Chou July 20, 2	2021-07-20
Method of fabricating packaging substrate Grant 11,031,329 - Hu , et al. June 8, 2	2021-06-08
Sensing Device And Manufacturing Method Thereof App 20210159151 - Tseng; Chao-Tsung ; et al.	2021-05-27
Flip-chip Package Substrate And Method For Fabricating The Same App 20210098351 - Chou; Pao-Hung ; et al.	2021-04-01
Semiconductor Package Substrate, Method For Fabricating The Same, And Electronic Package Having The Same App 20200388564 - Chou; Pao-Hung ; et al.	2020-12-10
Package Substrate App 20200388640 - YU; CHUN-HSIEN ; et al.	2020-12-10
Semiconductor Package Carrier Board, Method For Fabricating The Same, And Electronic Package Having The Same App 20200388552 - Chou; Pao-Hung ; et al.	2020-12-10
Method Of Fabricating Package Substrates App 20200332429 - YU; CHUN-HSIEN ; et al.	2020-10-22
Semiconductor Package Substrate, Electronic Package And Methods For Fabricating The Same App 20200312756 - Chou; Pao-Hung ; et al.	2020-10-01
Electronic package Grant 10,784,205 - Hu , et al. Sept	2020-09-22
Method of fabricating package substrates Grant 10,745,818 - Yu , et al. A	2020-08-18
Semiconductor Package Structure And Method Of Making The Same App 20200161234 - Hsu; Che-Wei ; et al.	2020-05-21
Surface Acoustic Wave Filter Package Structure And Method Of Manufacturing The Same App 20200153409 - Hsu; Shih-Ping ; et al.	2020-05-14
Semiconductor Package Structure And Method Of Making The Same App 20200135693 - Hu; Chu-Chin ; et al.	2020-04-30
Flip-chip Package Substrate And Method For Preparing The Same App 20200066624 - Chou; Pao-Hung ; et al.	2020-02-27
Method for fabricating bump structures on chips with panel type process Grant 10,483,232 - Hsu , et al. Nov	2019-11-19
Interposer substrate and method of fabricating the same Grant 10,483,194 - Chou , et al. Nov	2019-11-19
Flip-chip Packaging Substrate And Method For Fabricating The Same App 20190348375 - Chou; Pao-Hung ; et al.	2019-11-14
Semiconductor package structure and method of making the same Grant 10,475,752 - Hsu , et al. Nov	2019-11-12
Interposer substrate and method for manufacturing the same Grant 10,475,765 - Hsu , et al. Nov	2019-11-12
Flip-chip Package Substrate App 20190341357 - Hu; Chu-Chin ; et al.	2019-11-07
Semiconductor Package Structure And Method Of Making The Same App 20190279925 - Hsu; Shih-Ping ; et al.	2019-09-12
Electronic package and its package substrate Grant 10,366,906 - Yu , et al. July 30, 2	2019-07-30
Package substrate and its fabrication method Grant 10,347,575 - Yu , et al. July 9, 2	2019-07-09
Interposer substrate and method of fabricating the same Grant 10,283,442 - Hsu , et al.	2019-05-07
Substrate structure and manufacturing method thereof Grant 10,278,282 - Yu , et al.	2019-04-30
Electronic Package And Its Package Substrate App 20190074196 - Yu; Chun-Hsien ; et al.	2019-03-07
Interposer Substrate And Method For Manufacturing The Same App 20190074260 - Hsu; Shih-Ping ; et al.	2019-03-07
Method for Fabricating Bump Structures on Chips with Panel Type Process App 20190067242 - Hsu; Shih-Ping ; et al.	2019-02-28
Electronic package and conductive structure thereof Grant 10,204,865 - Hu , et al. Feb	2019-02-12
Semiconductor Package Structure and Method of Making the Same App 20180358304 - Hsu; Shih-Ping ; et al.	2018-12-13
Package Structure And Method Of Fabricating The Same App 20180315678 - Hsu; Shih-Ping ; et al.	2018-11-01
Manufacturing method of package substrate with metal on conductive portions Grant 10,117,340 - Hsu , et al. October 30, 2	2018-10-30
Interposer Substrate And Method Of Fabricating The Same App 20180286794 - Chou; Pao-Hung ; et al.	2018-10-04
Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding Grant 10,079,220 - Hu , et al. September 18, 2	2018-09-18
Methods of fabricating an electronic package structure Grant 10,079,190 - Hsu , et al. September 18, 2	2018-09-18
Package Structure And Method Of Manufacturing The Same App 20180261578 - HSU; Shih-Ping ; et al.	2018-09-13
Manufacturing Method Of Package Substrate With Metal On Conductive Portions App 20180255651 - HSU; Che-Wei ; et al.	2018-09-06
Package substrate Grant 10,062,649 - Hsu , et al. August 28, 2	2018-08-28
Interposer substrate and method of fabricating the same Grant 10,014,242 - Chou , et al. July 3, 2	2018-07-03
Package substrate with metal on conductive portions and manufacturing method thereof Grant 9,992,879 - Hsu , et al. June 5, 2	2018-06-05
Package structure and method of manufacturing the same Grant 9,972,599 - Hsu , et al. May 15, 2	2018-05-15
Package Substrate And Its Fabrication Method App 20180130745 - Hu; Chu-Chin ; et al.	2018-05-10
Package Substrate And Its Fabrication Method App 20180130771 - HU; CHU-CHIN ; et al.	2018-05-10
Package Substrate And Flip-chip Package Circuit Including The Same App 20180122734 - Hsu; Che-Wei ; et al.	2018-05-03
Package Structure And Its Fabrication Method App 20180108615 - HSU; SHIH-PING	2018-04-19
Substrate structure and manufacturing method thereof Grant 9,941,208 - Hsu April 10, 2	2018-04-10
Substrate Structure And Manufacturing Method Thereof App 20180082941 - Hsu; Shih-Ping	2018-03-22
Interposer substrate and method for fabricating the same Grant 9,911,626 - Chou March 6, 2	2018-03-06
Package stucture and method of fabricating the same Grant 9,905,503 - Hsu , et al. February 27, 2	2018-02-27
Interposer Substrate And Method Of Manufacturing The Same App 20180047662 - Hsu; Che-Wei ; et al.	2018-02-15
Package substrate and flip-chip package circuit including the same Grant 9,893,003 - Hsu , et al. February 13, 2	2018-02-13
Package substrate Grant 9,852,977 - Yu , et al. December 26, 2	2017-12-26
Interposer substrate and method of manufacturing the same Grant 9,831,165 - Hsu , et al. November 28, 2	2017-11-28
Method of fabricating package substrates Grant 9,831,217 - Hu , et al. November 28, 2	2017-11-28
Packaging Substrate And Method Of Fabricating The Same App 20170338174 - Hu; Chu-Chin ; et al.	2017-11-23
Package substrate, package structure including the same, and their fabrication methods Grant 9,824,964 - Yu , et al. November 21, 2	2017-11-21
Fabrication Method OF A Package Substrate App 20170317031 - HU; CHU-CHIN ; et al.	2017-11-02
Package Apparatus App 20170318683 - HSU; SHIH-PING	2017-11-02
IC carrier of semiconductor package and manufacturing method thereof Grant 9,806,012 - Hsu , et al. October 31, 2	2017-10-31
Substrate structure and manufacturing method thereof Grant 9,805,996 - Hsu , et al. October 31, 2	2017-10-31
Package Substrate App 20170309557 - HSU; Chin-Yao ; et al.	2017-10-26
Method Of Fabricating Package Substrates App 20170301652 - HU; CHU-CHIN ; et al.	2017-10-19
Package Substrate, Package Structure Including The Same, And Their Fabrication Methods App 20170287815 - YU; CHUN-HSIEN ; et al.	2017-10-05
Substrate structure Grant 9,780,022 - Chou October 3, 2	2017-10-03
Packaging module and substrate structure thereof Grant 9,754,982 - Yu , et al. September 5, 2	2017-09-05
Method for manufacturing an electronic package Grant 9,750,142 - Hsu August 29, 2	2017-08-29
Package substrate and its fabrication method Grant 9,741,646 - Hsu , et al. August 22, 2	2017-08-22
Package Substrate App 20170207173 - HSU; SHIH-PING ; et al.	2017-07-20
Substrate Structure and Manufacturing Method Thereof App 20170208683 - Yu; Chun-Hsien ; et al.	2017-07-20
Packaging module and substrate structure thereof Grant 9,711,444 - Hu July 18, 2	2017-07-18
Package substrate, package structure including the same, and their fabrication methods Grant 9,711,445 - Yu , et al. July 18, 2	2017-07-18
Method Of Fabricating Package Substrates App 20170198406 - YU; CHUN-HSIEN ; et al.	2017-07-13
Package Substrate And Its Fabrication Method App 20170194262 - HU; CHU-CHIN ; et al.	2017-07-06
IC Carrier of Semiconductor Package and Manufacturing Method Thereof App 20170162492 - Hsu; Shih-Ping ; et al.	2017-06-08
Package Substrate App 20170148724 - YU; CHUN-HSIEN ; et al.	2017-05-25
Electronic package Grant 9,613,894 - Hu , et al. April 4, 2	2017-04-04
Package apparatus and manufacturing method thereof Grant 9,601,402 - Chou , et al. March 21, 2	2017-03-21
Package apparatus and manufacturing method thereof Grant 9,589,935 - Hu , et al. March 7, 2	2017-03-07
Package apparatus and manufacturing method thereof Grant 9,583,436 - Tseng , et al. February 28, 2	2017-02-28
Packaging Module And Substrate Structure Thereof App 20170047279 - Hu; Wen-Hung	2017-02-16
Package Substrate And Its Fabrication Method App 20170047278 - YU; CHUN-HSIEN ; et al.	2017-02-16
Package Substrate And Manufacturing Method Thereof App 20170034908 - Hsu; Che-Wei ; et al.	2017-02-02
Substrate Structure and Manufacturing Method Thereof App 20170018491 - Chou; Pao-Hung	2017-01-19
Substrate Structure and Manufacturing Method Thereof App 20170019995 - Hsu; Shih-Ping ; et al.	2017-01-19
Package substrate and flip-chip package circuit including the same Grant 9,548,234 - Hsu , et al. January 17, 2	2017-01-17
Package structure and its fabrication method Grant 9,536,864 - Hsu January 3, 2	2017-01-03
Packaging Module And Substrate Structure Thereof App 20160268326 - Yu; Chun-Hsien ; et al.	2016-09-15
Package Substrate, Package Structure Including The Same, And Their Fabrication Methods App 20160260655 - YU; CHUN-HSIEN ; et al.	2016-09-08
Package Structure And Its Fabrication Method App 20160240514 - HSU; SHIH-PING	2016-08-18
Electronic Package And Conductive Structure Thereof App 20160212851 - Hu; Chu-Chin ; et al.	2016-07-21
Electronic Package App 20160212852 - Hu; Chu-Chin ; et al.	2016-07-21
Electronic Package App 20160211204 - Hu; Chu-Chin ; et al.	2016-07-21
Package Apparatus And Manufacturing Method Thereof App 20160190059 - TSENG; CHAO-TSUNG ; et al.	2016-06-30
Stacked Package Structure App 20160192525 - Hu; Chu-Chin ; et al.	2016-06-30
Package Stucture And Method Of Fabricating The Same App 20160181193 - Hsu; Shih-Ping ; et al.	2016-06-23
Package apparatus with multiple pillar layers Grant 9,370,105 - Hsu , et al. June 14, 2	2016-06-14
Package Apparatus And Manufacturing Method Thereof App 20160163677 - HU; CHU-CHIN ; et al.	2016-06-09
Interposer Substrate And Method Of Fabricating The Same App 20160163626 - Chou; Pao-Hung ; et al.	2016-06-09
Interposer Substrate And Method Of Fabricating The Same App 20160163627 - Hsu; Che-Wei ; et al.	2016-06-09
Semiconductor Package And Method Of Fabricating The Same App 20160163629 - Hsu; Shih-Ping ; et al.	2016-06-09
Interposer Substrate And Method Of Fabricating The Same App 20160165722 - Hsu; Che-Wei ; et al.	2016-06-09
Package Structure And Method Of Fabricating The Same App 20160135299 - Hsu; Shih-Ping ; et al.	2016-05-12
Interposer substrate and method of fabricating the same Grant 9,338,900 - Chou , et al. May 10, 2	2016-05-10
Package Substrate And Flip-chip Package Circuit Including The Same App 20160118327 - HSU; CHE-WEI ; et al.	2016-04-28
Package Structure And Method Of Fabricating The Same App 20160104652 - Hsu; Shih-Ping ; et al.	2016-04-14
Interposer Substrate And Method Of Fabricating The Same App 20160073516 - CHOU; Pao-Hung ; et al.	2016-03-10
Interposer Substrate And Method Of Manufacturing The Same App 20160064317 - HSU; Che-Wei ; et al.	2016-03-03
Substrate Structure And Method Of Manufacturing The Same App 20160055403 - CHOU; Pao-Hung	2016-02-25
Package Substrate And Its Fabrication Method App 20160043025 - HSU; CHIN-YAO ; et al.	2016-02-11
Interposer Substrate And A Method Of Fabricating The Same App 20160037635 - CHOU; Pao-Hung	2016-02-04
Interposer Substrate And Method For Fabricating The Same App 20160037634 - CHOU; Pao-Hung	2016-02-04
Package Apparatus And Manufacturing Method Thereof App 20150382469 - HU; Chu-Chin ; et al.	2015-12-31
Package Substrate And Flip-chip Package Circuit Including The Same App 20150364408 - HSU; CHE-WEI ; et al.	2015-12-17
Package Method App 20150364435 - HSU; CHE-WEI ; et al.	2015-12-17
Package Apparatus And Manufacturing Method Thereof App 20150366064 - HSU; CHE-WEI ; et al.	2015-12-17
Package method Grant 9,214,437 - Hsu , et al. December 15, 2	2015-12-15
Package Structure And Method Of Manufacturing The Same App 20150359096 - HSU; Shih-Ping ; et al.	2015-12-10
Package Apparatus And Manufacturing Method Thereof App 20150279777 - HSU; SHIH-PING	2015-10-01
Package Structure And Its Fabrication Method App 20150279818 - HSU; SHIH-PING	2015-10-01
Package Apparatus And Manufacturing Method Thereof App 20150235916 - CHOU; E-TUNG ; et al.	2015-08-20