Phelps, Jr.; Douglas W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Phelps, Jr.; Douglas W..The latest application filed is for "semiconductor package with ground plane".
- Phelps, Jr.; Douglas W. - Burlington VT
| Patent | Date |
|---|---|
| Semiconductor package with ground plane Grant 4,965,654 - Karner , et al. October 23, 1 | 1990-10-23 |
| Method of bonding gold or gold alloy wire to lead tin solder Grant 4,907,734 - Conru , et al. March 13, 1 | 1990-03-13 |
| Heat dissipation package for integrated circuits Grant 4,878,108 - Phelps, Jr. , et al. October 31, 1 | 1989-10-31 |
| Package semiconductor chip Grant 4,862,245 - Pashby , et al. August 29, 1 | 1989-08-29 |
| Single lead automatic clamping and bonding system Grant 4,821,945 - Chase , et al. April 18, 1 | 1989-04-18 |
| Peripheral/area wire bonding technique Grant 4,796,078 - Phelps, Jr. , et al. January 3, 1 | 1989-01-03 |
| Substrate with multiple type connections Grant 4,447,857 - Marks , et al. May 8, 1 | 1984-05-08 |
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