Phee; Jae-Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Phee; Jae-Hyun.The latest application filed is for "method of forming an interposer and a method of manufacturing a semiconductor package including the same".

Company Profile

0.13.13

Phee; Jae-Hyun - Incheon KR
Phee; Jae-hyun - Yongin-si N/A KR
Phee; Jae-hyun - Gyeyang-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Forming An Interposer And A Method Of Manufacturing A Semiconductor Package Including The Same App 20180108540 - Phee; Jae-Hyun ; et al.	2018-04-19
Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same Grant 8,778,776 - Choi , et al. July 15, 2	2014-07-15
Semiconductor Device And Method For Fabricating The Same App 20140145327 - JEON; Hyung-Jun ; et al.	2014-05-29
Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes Grant 8,637,989 - Lee , et al. January 28, 2	2014-01-28
Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package Grant 8,586,477 - Jeong , et al. November 19, 2	2013-11-19
Semiconductor devices having electrodes Grant 8,575,760 - Phee , et al. November 5, 2	2013-11-05
Semiconductor device having through silicon via (TSV) Grant 8,564,102 - Choi , et al. October 22, 2	2013-10-22
Multi-layer TSV insulation and methods of fabricating the same Grant 8,492,902 - Lee , et al. July 23, 2	2013-07-23
Semiconductor Chip Having Via Electrodes And Stacked Semiconductor Chips Interconnected By The Via Electrodes App 20120299194 - Lee; Ho-jin ; et al.	2012-11-29
Apparatus And Method For Electroplating For Semiconductor Substrate App 20120292195 - LEE; Ui Hyoung ; et al.	2012-11-22
Semiconductor Device And Method Of Fabricating The Semiconductor Device App 20120199981 - Jeong; Se-young ; et al.	2012-08-09
Semiconductor Devices Having Electrodes and Methods of Fabricating the Same App 20120133041 - Phee; Jae-hyun ; et al.	2012-05-31
Methods of Forming a Semiconductor Package Using a Seed Layer and Semiconductor Packages Formed Using the Same App 20120083097 - Choi; Ju-il ; et al.	2012-04-05
Multi-layer Tsv Insulation And Methods Of Fabricating The Same App 20120074584 - LEE; Ho-Jin ; et al.	2012-03-29
Semiconductor package and methods of manufacturing the same Grant 8,129,840 - Jo , et al. March 6, 2	2012-03-06
Semiconductor Apparatus, Method Of Manufacturing The Same, And Method Of Manufacturing Semiconductor Package App 20120028412 - Jeong; Se-young ; et al.	2012-02-02
Semiconductor Device And Method Of Fabricating The Same App 20110284936 - CHOI; Ju-il ; et al.	2011-11-24
Apparatus And Method For Treating Substrate App 20110226626 - Choi; Ju-il ; et al.	2011-09-22
Semiconductor Chip Having Via Electrodes And Stacked Semiconductor Chips Interconnected By The Via Electrodes App 20100105169 - Lee; Ho-jin ; et al.	2010-04-29
Semiconductor Package And Methods Of Manufacturing The Same App 20100013094 - JO; Chajea ; et al.	2010-01-21

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