Pham; Ken

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pham; Ken.The latest application filed is for "integrated magnetic core and winding lamina".

Company Profile

4.31.22

Pham; Ken - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Magnetic Core And Winding Lamina App 20220310302 - Yan; Yi ; et al.	2022-09-29
Spot-solderable leads for semiconductor device packages Grant 11,430,719 - Prakuzhy , et al. August 30, 2	2022-08-30
Stacked die semiconductor package Grant 11,075,147 - Kim , et al. July 27, 2	2021-07-27
Stacked Die Semiconductor Package App 20210013138 - Kim; Woochan ; et al.	2021-01-14
Die Isolation On A Substrate App 20200135632 - Mishra; Dibyajat ; et al.	2020-04-30
Spot-solderable leads for semiconductor device packages Grant 10,607,927 - Prakuzhy , et al.	2020-03-31
Semiconductor systems having dual leadframes Grant 10,573,582 - Joshi , et al. Feb	2020-02-25
Spot-Solderable Leads for Semiconductor Device Packages App 20190318983 - Prakuzhy; Manu A. ; et al.	2019-10-17
Semiconductor Systems Having Premolded Dual Leadframes App 20190237395 - Joshi; Rajeev D. ; et al.	2019-08-01
Semiconductor systems having premolded dual leadframes Grant 10,312,184 - Joshi , et al.	2019-06-04
Spot-Solderable Leads for Semiconductor Device Packages App 20180076116 - Prakuzhy; Manu J. ; et al.	2018-03-15
Semiconductor Systems Having Premolded Dual Leadframes App 20170125324 - Joshi; Rajeev D. ; et al.	2017-05-04
Lead frame interconnect scheme with high power density Grant 8,283,760 - Pham , et al. October 9, 2	2012-10-09
Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds Grant 8,267,303 - Pham September 18, 2	2012-09-18
Wirebonding Method And Device Enabling High-speed Reverse Wedge Bonding Of Wire Bonds App 20120032354 - Pham; Ken ; et al.	2012-02-09
Wire Bonding Method And Capillary Enabling High-speed Wedge Bonding Of Wire Bonds App 20120031955 - Pham; Ken	2012-02-09
Wire bonding deflector for a wire bonder Grant 7,918,378 - Pham April 5, 2	2011-04-05
Leadframe panel Grant 7,714,418 - Lim , et al. May 11, 2	2010-05-11
Thin Foil For Use In Packaging Integrated Circuits App 20100084748 - PODDAR; Anindya ; et al.	2010-04-08
Leadframe Panel App 20090026590 - LIM; Peng Soon ; et al.	2009-01-29
Ceramic optical sub-assembly for optoelectronic modules Grant 7,269,027 - Liu , et al. September 11, 2	2007-09-11
Techniques for joining an opto-electronic module to a semiconductor package Grant 7,247,942 - Nguyen , et al. July 24, 2	2007-07-24
Techniques for joining an opto-electronic module to a semiconductor package Grant 7,199,440 - Nguyen , et al. April 3, 2	2007-04-03
Technique for protecting photonic devices in optoelectronic packages with clear overmolding Grant 7,195,955 - Nguyen , et al. March 27, 2	2007-03-27
Optical sub-assembly for opto-electronic modules Grant 7,086,788 - Mazotti , et al. August 8, 2	2006-08-08
Ceramic optical sub-assembly for optoelectronic modules App 20060140534 - Liu; Jia ; et al.	2006-06-29
Post singulation die separation apparatus and method for bulk feeding operation Grant 7,045,035 - Kelkar , et al. May 16, 2	2006-05-16
Ceramic optical sub-assembly for optoelectronic modules Grant 7,023,705 - Liu , et al. April 4, 2	2006-04-04
Semiconductor package having flash-free contacts and techniques for manufacturing the same App 20060055080 - Pham; Ken ; et al.	2006-03-16
Technique for protecting photonic devices in optoelectronic packages with clear overmolding Grant 7,001,083 - Nguyen , et al. February 21, 2	2006-02-21
Techniques for manufacturing flash-free contacts on a semiconductor package Grant 6,989,122 - Pham , et al. January 24, 2	2006-01-24
Technique for protecting photonic devices in optoelectronic packages with clear overmolding App 20060001183 - Nguyen; Luu Thanh ; et al.	2006-01-05
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package Grant 6,973,225 - Nguyen , et al. December 6, 2	2005-12-06
Post singulation die separation apparatus and method for bulk feeding operation Grant 6,932,136 - Kelkar , et al. August 23, 2	2005-08-23
Optical sub-assembly for opto-electronic modules App 20050175297 - Mazotti, William Paul ; et al.	2005-08-11
Optical sub-assembly for optoelectronic modules Grant 6,916,121 - Mazotti , et al. July 12, 2	2005-07-12
Techniques for joining an opto-electronic module to a semiconductor package App 20050117835 - Nguyen, Luu Thanh ; et al.	2005-06-02
Techniques for joining an opto-electronic module to a semiconductor package App 20050100294 - Nguyen, Luu Thanh ; et al.	2005-05-12
Techniques for joining an opto-electronic module to a semiconductor package Grant 6,858,468 - Nguyen , et al. February 22, 2	2005-02-22
Techniques for joining an opto-electronic module to a semiconductor package Grant 6,838,317 - Nguyen , et al. January 4, 2	2005-01-04
Electrical connector for opto-electronic modules Grant 6,802,654 - Roberts , et al. October 12, 2	2004-10-12
Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards Grant 6,749,345 - Gee , et al. June 15, 2	2004-06-15
Encapsulant material applicator for semiconductor wafers and method of use thereof Grant 6,730,170 - Pham , et al. May 4, 2	2004-05-04
Techniques for joining an opto-electronic module to a semiconductor package App 20040048417 - Nguyen, Luu Thanh ; et al.	2004-03-11
Optoelectronic package with dam structure to provide fiber standoff Grant 6,655,854 - Nguyen , et al. December 2, 2	2003-12-02
Techniques for joining an opto-electronic module to a semiconductor package Grant 6,642,613 - Nguyen , et al. November 4, 2	2003-11-04
Techniques for joining an opto-electronic module to a semiconductor package App 20030189214 - Nguyen, Luu Thanh ; et al.	2003-10-09
Techniques for maintaining parallelism between optical and chip sub-assemblies Grant 6,628,000 - Pham , et al. September 30, 2	2003-09-30
Miniature semiconductor package for opto-electronic devices Grant 6,624,507 - Nguyen , et al. September 23, 2	2003-09-23
Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package App 20030057535 - Nguyen, Luu Thanh ; et al.	2003-03-27
Ceramic optical sub-assembly for optoelectronic modules App 20030026081 - Liu, Jia ; et al.	2003-02-06
Optical sub-assembly for optoelectronic modules App 20030026556 - Mazotti, William Paul ; et al.	2003-02-06
Metal coated markings on integrated circuit devices Grant 6,448,632 - Takiar , et al. September 10, 2	2002-09-10

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