loadpatents
Patent applications and USPTO patent grants for PFG IP LLC.The latest application filed is for "wire bond through-via structure and method".
Patent | Date |
---|---|
Wire bond through-via structure and method Grant 9,741,680 - Bindrup , et al. August 22, 2 | 2017-08-22 |
Cap chip and reroute layer for stacked microelectronic module Grant 9,728,507 - He , et al. August 8, 2 | 2017-08-08 |
Wire bond through-via structure and method Grant 9,431,275 - Bindrup , et al. August 30, 2 | 2016-08-30 |
Sensor system comprising stacked micro-channel plate detector Grant 9,142,380 - Azzazy , et al. September 22, 2 | 2015-09-22 |
Stacked micro-channel plate assembly comprising a micro-lens Grant 9,129,780 - Azzazy , et al. September 8, 2 | 2015-09-08 |
Solid state drive memory device comprising secure erase function Grant 9,111,621 - Krutzik , et al. August 18, 2 | 2015-08-18 |
Self-calibrating targeting sight Grant 9,046,322 - Justice , et al. June 2, 2 | 2015-06-02 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.