Petzold; Gunnar
Patent Applications and Registrations
Patent applications and USPTO patent grants for Petzold; Gunnar.The latest application filed is for "soldering material based on sn ag and cu".
- Petzold; Gunnar - Dresden DE
- Petzold; Gunnar - Berlin DE
| Patent | Date |
|---|---|
| Soldering Material Based On Sn Ag And Cu App 20220168851 - Albrecht; Hans-Jurgen ; et al. | 2022-06-02 |
| Soldering material based on Sn Ag and Cu Grant 11,285,569 - Albrecht , et al. March 29, 2 | 2022-03-29 |
| Soldering Material Based On Sn Ag And Cu App 20200023472 - Albrecht; Hans-Jurgen ; et al. | 2020-01-23 |
| Soldering material based on Sn Ag and Cu Grant 10,376,994 - Albrecht , et al. A | 2019-08-13 |
| Soldering material based on sn ag and cu App 20070036671 - Albrecht; Hans-Jurgen ; et al. | 2007-02-15 |
| Substrate for producing a soldering connection to a second substrate App 20060237855 - Kroehnert; Steffen ; et al. | 2006-10-26 |
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