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Patent applications and USPTO patent grants for Petty-Weeks; Sandra L..The latest application filed is for "integrated passive cap in a system-in-package".
Patent | Date |
---|---|
Integrated passive cap in a system-in-package App 20080217708 - Reisner; Russ ;   et al. | 2008-09-11 |
Semiconductor die package with reduced inductance and reduced die attach flow out Grant 7,164,192 - Petty-Weeks , et al. January 16, 2 | 2007-01-16 |
Overmolded MCM with increased surface mount component reliability App 20050011672 - Alawani, Ashish D. ;   et al. | 2005-01-20 |
Semiconductor die package with increased thermal conduction Grant 6,787,896 - Petty-Weeks September 7, 2 | 2004-09-07 |
Semiconductor die package with reduced inductance and reduced die attach flow out App 20040155332 - Petty-Weeks, Sandra L. ;   et al. | 2004-08-12 |
Dielectric sensors Grant 5,018,380 - Zupancic , et al. May 28, 1 | 1991-05-28 |
Method and apparatus for gas detection using proton-conducting polymers Grant 4,664,757 - Zupancic , et al. * May 12, 1 | 1987-05-12 |
Electrochemical method and apparatus using proton-conducting polymers Grant 4,664,761 - Zupancic , et al. May 12, 1 | 1987-05-12 |
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