loadpatents
name:-0.0090200901031494
name:-0.0083129405975342
name:-0.0036499500274658
Pettit; Jared Patent Filings

Pettit; Jared

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pettit; Jared.The latest application filed is for "etch chemistries for metallization in electronic devices".

Company Profile
3.9.10
  • Pettit; Jared - Camarillo CA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Etch chemistries for metallization in electronic devices
Grant 10,923,514 - Hogan , et al. February 16, 2
2021-02-16
Etch Chemistries For Metallization In Electronic Devices
App 20190148420 - HOGAN; Patrick ;   et al.
2019-05-16
Release layer for subsequent manufacture of flexible substrates in microelectronic applications
Grant 10,290,531 - Moore , et al.
2019-05-14
Etch chemistries for metallization in electronic devices
Grant 10,186,530 - Hogan , et al. Ja
2019-01-22
Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
Grant 10,000,675 - Moore , et al. June 19, 2
2018-06-19
Aqueous detergent soluble coating and adhesive and methods of temporary bonding for manufacturing
Grant 9,790,407 - Moore , et al. October 17, 2
2017-10-17
Etch Chemistries For Metallization In Electronic Devices
App 20160372500 - HOGAN; Patrick ;   et al.
2016-12-22
Etch chemistries for metallization in electronic devices
Grant 9,455,283 - Hogan , et al. September 27, 2
2016-09-27
Release Layer For Subsequent Manufacture Of Flexible Substrates In Microelectronic Applications
App 20160071756 - Moore; John Cleaon ;   et al.
2016-03-10
Temporary Adhesive With Tunable Adhesion Force Sufficient For Processing Thin Solid Materials
App 20160017196 - Moore; John Cleaon ;   et al.
2016-01-21
Adhesive With Tunable Porosity And Methods To Support Temporary Bonding Applications
App 20160017184 - Moore; John Cleaon ;   et al.
2016-01-21
Aqueous Detergent Soluble Coating And Adhesive And Methods Of Temporary Bonding For Manufacturing
App 20160009958 - Moore; John Cleaon ;   et al.
2016-01-14
Etch Chemistries For Metallization In Electronic Devices
App 20150255494 - Hogan; Patrick ;   et al.
2015-09-10

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