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Patent applications and USPTO patent grants for Pettis; Rodney L..The latest application filed is for "die-cut patterns for blister package".
Patent | Date |
---|---|
Die-cut Patterns For Blister Package App 20130306511 - Branyon; Jacob D. ;   et al. | 2013-11-21 |
Elastomer and polyolefin resin based films and associated methods Grant 7,582,341 - Pettis September 1, 2 | 2009-09-01 |
Elastomer and polyolefin resin based films and associated methods Grant 7,083,838 - Pettis August 1, 2 | 2006-08-01 |
Elastomer and polyolefin resin based films and associated methods App 20060127657 - Pettis; Rodney L. | 2006-06-15 |
Elastomer and polyolefin resin based films and associated methods App 20040137206 - Pettis, Rodney L. | 2004-07-15 |
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