Petriwsky; Tammy Lynn

Patent Applications and Registrations

Patent applications and USPTO patent grants for Petriwsky; Tammy Lynn.The latest application filed is for "high silicate glass articles possessing through glass vias and methods of making and using thereof".

Company Profile

3.6.7

Petriwsky; Tammy Lynn - Elmira NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Assembly substrates including through hole vias and methods for making such Grant 10,879,182 - Garner , et al. December 29, 2	2020-12-29
High Silicate Glass Articles Possessing Through Glass Vias And Methods Of Making And Using Thereof App 20200354262 - Guo; Xiaoju ; et al.	2020-11-12
Assembly Substrates Including Through Hole Vias And Methods For Making Such App 20200118931 - Garner; Sean Matthew ; et al.	2020-04-16
Method For Controlling Surface Features On Glass-ceramic Articles And Articles Formed Therefrom App 20190218138 - Bazemore; Brandon Allen ; et al.	2019-07-18
Method for controlling surface features on glass-ceramic articles and articles formed therefrom Grant 10,239,782 - Bazemore , et al.	2019-03-26
Methods of etching glass substrates and glass substrates Grant 10,077,206 - Castle , et al. September 18, 2	2018-09-18
Etch rate enhancement at low temperatures Grant 9,745,220 - Burket , et al. August 29, 2	2017-08-29
Methods for forming vias in glass substrates Grant 9,656,909 - Burket , et al. May 23, 2	2017-05-23
Methods Of Etching Glass Substrates And Glass Substrates App 20160362331 - Castle; Thomas Michael ; et al.	2016-12-15
Method For Controlling Surface Features On Glass-ceramic Articles And Articles Formed Therefrom App 20160251259 - Bazemore; Brandon Allen ; et al.	2016-09-01
Etch Rate Enhancement At Low Temperatures App 20160145149 - Burket; Robert Carl ; et al.	2016-05-26
Methods for forming vias in glass substrates Grant 9,296,646 - Burket , et al. March 29, 2	2016-03-29
Methods For Forming Vias In Glass Substrates App 20150060402 - Burkett; Robert Carl ; et al.	2015-03-05

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