Patent | Date |
---|
Method for controlling a manufacturing process and associated apparatuses Grant 11,187,994 - Kamali , et al. November 30, 2 | 2021-11-30 |
Process Window Based On Defect Probability App 20210356874 - SLACHTER; Abraham ;   et al. | 2021-11-18 |
Method of manufacturing devices Grant 11,087,065 - Mahajan , et al. August 10, 2 | 2021-08-10 |
Process window based on defect probability Grant 11,079,687 - Slachter , et al. August 3, 2 | 2021-08-03 |
Voltage Contrast Metrology Mark App 20210088917 - TABERY; Cyrus Emil ;   et al. | 2021-03-25 |
Information determining apparatus and method Grant 10,948,837 - Gao , et al. March 16, 2 | 2021-03-16 |
Process Window Based On Defect Probability App 20210018850 - SLACHTER; Abraham ;   et al. | 2021-01-21 |
Metallic gratings and measurement methods thereof Grant 10,883,924 - O' Mullane , et al. January 5, 2 | 2021-01-05 |
Information Determining Apparatus And Method App 20200159134 - GAO; An ;   et al. | 2020-05-21 |
Clearing Out Method, Revealing Device, Lithographic Apparatus, And Device Manufacturing Method App 20200152527 - JEUNINK; Andre Bernardus ;   et al. | 2020-05-14 |
Method Of Manufacturing Devices App 20200097633 - MAHAJAN; Sunit Sondhi ;   et al. | 2020-03-26 |
Metrology Apparatus and Method for Determining a Characteristic of One or More Structures on a Substrate App 20190378012 - Tripodi; Lorenzo ;   et al. | 2019-12-12 |
High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella Grant 10,283,317 - Keady , et al. | 2019-05-07 |
Via characterization for BCD and depth metrology Grant 10,254,110 - Xiao , et al. | 2019-04-09 |
High Throughput Tem Preparation Processes And Hardware For Backside Thinning Of Cross-sectional View Lamella App 20170250055 - Keady; Paul ;   et al. | 2017-08-31 |
High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella Grant 9,653,260 - Keady , et al. May 16, 2 | 2017-05-16 |
Metallic Gratings And Measurement Methods Thereof App 20160069792 - O'Mullane; Sam ;   et al. | 2016-03-10 |
Measurement and endpointing of sample thickness Grant 9,184,025 - Young , et al. November 10, 2 | 2015-11-10 |
Via Characterization For Bcd And Depth Metrology App 20150168128 - XIAO; Ke ;   et al. | 2015-06-18 |
High Throughput TEM Preparation Processes and Hardware for Backside Thinning of Cross-Sectional View Lamella App 20130248354 - Keady; Paul ;   et al. | 2013-09-26 |
Measurement And Endpointing Of Sample Thickness App 20120187285 - YOUNG; RICHARD J. ;   et al. | 2012-07-26 |
Measurement and endpointing of sample thickness Grant 8,170,832 - Young , et al. May 1, 2 | 2012-05-01 |
Barrier formation and structure to use in semiconductor devices Grant 7,768,126 - Fischer , et al. August 3, 2 | 2010-08-03 |
Measurement And Endpointing Of Sample Thickness App 20100116977 - Young; Richard J. ;   et al. | 2010-05-13 |
Barrier process/structure for transistor trench contact applications App 20090170309 - Chikarmane; Vinay ;   et al. | 2009-07-02 |
Barrier process/structure for transistor trench contact applications Grant 7,525,197 - Chikarmane , et al. April 28, 2 | 2009-04-28 |
Barrier formation and structure to use in semiconductor devices App 20080079165 - Fischer; Kevin ;   et al. | 2008-04-03 |
Barrier process/structure for transistor trench contact applications App 20080026556 - Chikarmane; Vinay ;   et al. | 2008-01-31 |