| Patent | Date |
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Method of embedding components in multi-layer circuit boards
Grant 7,513,037 - McCormack , et al. April 7, 2 | 2009-04-07 |
Structure and method of embedding components in multi-layer substrates
App 20050153060 - McCormack, Mark Thomas ; et al. | 2005-07-14 |
Method of fabricating a substrate with a via connection
Grant 6,662,443 - Chou , et al. December 16, 2 | 2003-12-16 |
Composite interposer and method for producing a composite interposer
Grant 6,521,530 - Peters , et al. February 18, 2 | 2003-02-18 |
Structure and method of embedding components in multi-layer substrates
App 20020175402 - McCormack, Mark Thomas ; et al. | 2002-11-28 |
Composite interposer and method for producing a composite interposer
App 20020076919 - Peters, Michael G. ; et al. | 2002-06-20 |
Method of fabricating a substrate with a via connection
App 20020000037 - Chou, William T. ; et al. | 2002-01-03 |
Reduced cross-talk noise high density signal interposer with power and ground wrap
Grant 6,239,485 - Peters , et al. May 29, 2 | 2001-05-29 |
Method for electroplating vias or through holes in substrates having conductors on both sides
Grant 6,197,664 - Lee , et al. March 6, 2 | 2001-03-06 |
Method of fabrication of multiple-layer high density substrate
Grant 6,187,652 - Chou , et al. February 13, 2 | 2001-02-13 |
Flip chip pre-assembly underfill process
Grant 6,168,972 - Wang , et al. January 2, 2 | 2001-01-02 |
Controlled impedance interposer substrate and method of making
Grant 6,102,710 - Beilin , et al. August 15, 2 | 2000-08-15 |
High density signal interposer with power and ground wrap
Grant 6,081,026 - Wang , et al. June 27, 2 | 2000-06-27 |
Process flows for formation of fine structure layer pairs on flexible films
Grant 6,039,889 - Zhang , et al. March 21, 2 | 2000-03-21 |
Methods of etching through wafers and substrates with a composite etch stop layer
Grant 5,891,354 - Lee , et al. April 6, 1 | 1999-04-06 |
Controlled impedence interposer substrate
Grant 5,854,534 - Beilin , et al. December 29, 1 | 1998-12-29 |
High-yield methods of fabricating large substrate capacitors
Grant 5,817,533 - Sen , et al. October 6, 1 | 1998-10-06 |
Method of making a multichip module substrate
Grant 5,778,529 - Beilin , et al. July 14, 1 | 1998-07-14 |
Substrate with thin film capacitor and insulating plug
Grant 5,652,693 - Chou , et al. July 29, 1 | 1997-07-29 |
Method for making continuous thin diamond film
Grant 5,607,723 - Plano , et al. March 4, 1 | 1997-03-04 |
Multichip module substrate
Grant 5,544,017 - Beilin , et al. August 6, 1 | 1996-08-06 |
Through hole interconnect substrate fabrication process
Grant 5,454,161 - Beilin , et al. October 3, 1 | 1995-10-03 |
Process for fabricating a substrate with thin film capacitor and insulating plug
Grant 5,455,064 - Chou , et al. October 3, 1 | 1995-10-03 |
Continuous thin diamond film and method for making same
Grant 5,432,003 - Plano , et al. July 11, 1 | 1995-07-11 |
Method for fabricating thin-film interconnector
Grant 5,419,038 - Wang , et al. May 30, 1 | 1995-05-30 |
Process for fabricating a substrate with thin film capacitor
Grant 5,323,520 - Peters , et al. June 28, 1 | 1994-06-28 |
Methods for coating adherent diamond films on cemented tungsten carbide substrates
Grant 5,236,740 - Peters , et al. August 17, 1 | 1993-08-17 |
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