PETERNEL; Joyce J. M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for PETERNEL; Joyce J. M..The latest application filed is for "thermal packaging with fan out wafer level processing".
- PETERNEL; Joyce J. M. - Morgan Hill CA
| Patent | Date |
|---|---|
| Thermal Packaging With Fan Out Wafer Level Processing App 20220278022 - ERICKSON; Ashley J.M. ; et al. | 2022-09-01 |
| Thermal packaging with fan out wafer level processing Grant 11,373,930 - Erickson , et al. June 28, 2 | 2022-06-28 |
| Connection features for electronic and optical packaging Grant 11,215,775 - Maker , et al. January 4, 2 | 2022-01-04 |
| Thermal Packaging With Fan Out Wafer Level Processing App 20210305128 - ERICKSON; Ashley J.M. ; et al. | 2021-09-30 |
| Connection Features For Electronic And Optical Packaging App 20210055489 - MAKER; Ashley J. ; et al. | 2021-02-25 |
| Electromagnetic isolating ball spring Grant 9,256,039 - Peternel , et al. February 9, 2 | 2016-02-09 |
| Electromagnetic Isolating Ball Spring App 20140193121 - Peternel; Joyce J.M. ; et al. | 2014-07-10 |
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