Peter Wolters GmbH

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peter Wolters GmbH.The latest application filed is for "device and method for determining the position of a working surface of a working disc".

Company Profile

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Peter Wolters GmbH - Rendsburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers Grant 9,539,695 - Pietsch , et al. January 10, 2	2017-01-10
Apparatus for double-sided, grinding machining of flat workpieces Grant 9,004,981 - Fries April 14, 2	2015-04-14
Method for machining flat workpieces Grant 8,951,096 - Kanzow , et al. February 10, 2	2015-02-10
Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers Grant 8,512,099 - Kerstan , et al. August 20, 2	2013-08-20
Device and Method for Determining the Position of a Working Surface of a Working Disc App 20120293811 - Grotkopp; Ingo ; et al.	2012-11-22
Device and Method for the Double-Sided Processing of Flat Work Pieces App 20120220197 - Boller; Hans-Peter ; et al.	2012-08-30
Method for Machining Flat Workpieces App 20120164919 - Kanzow; Jorn ; et al.	2012-06-28
Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding Machine App 20120052771 - Runkel; Frank	2012-03-01
Method for the simultaneous grinding of a plurality of semiconductor wafers Grant 8,113,913 - Pietsch , et al. February 14, 2	2012-02-14
Apparatus for Double-Sided, Grinding Machining of Flat Workpieces App 20110300785 - Fries; Adrian	2011-12-08
Method For Measuring The Thickness Of A Discoidal Workpiece App 20110222071 - Grotkopp; Ingo ; et al.	2011-09-15
Machining machine with means for acquiring machining parameters Grant 7,963,823 - Fischer June 21, 2	2011-06-21
Method for the simultaneous double-side grinding of a plurality of semiconductor wafers Grant 7,815,489 - Pietsch , et al. October 19, 2	2010-10-19
Machining Machine With Means For Acquiring Machining Parameters App 20080304929 - Fischer; Harald	2008-12-11

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