Perry; Charles H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Perry; Charles H..The latest application filed is for "method of making an electronic package".
- Perry; Charles H. - Poughkeepsie NY
- Perry; Charles H - Poughkeepsie NY
- Perry; Charles H. - Putnam CT
| Patent | Date |
|---|---|
| Method of making an electronic package App 20070278654 - Jimarez; Lisa J. ; et al. | 2007-12-06 |
| Method of making an electronic package Grant 7,278,207 - Jimarez , et al. October 9, 2 | 2007-10-09 |
| Method of making an electronic package App 20050250249 - Jimarez, Lisa J. ; et al. | 2005-11-10 |
| Method of making an electronic package Grant 6,961,995 - Jimarez , et al. November 8, 2 | 2005-11-08 |
| Conductive polymer interconnection configurations Grant 6,858,111 - Perry , et al. February 22, 2 | 2005-02-22 |
| Electrical coupling of substrates by conductive buttons Grant 6,848,914 - Beaman , et al. February 1, 2 | 2005-02-01 |
| Electrical coupling of substrates by conductive buttons App 20030073329 - Beaman, Brian S. ; et al. | 2003-04-17 |
| Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof Grant 6,548,175 - Sachdev , et al. April 15, 2 | 2003-04-15 |
| Polymer and ceramic composite electronic substrates Grant 6,528,145 - Berger , et al. March 4, 2 | 2003-03-04 |
| Self-scrub buckling beam probe Grant 6,529,021 - Yu , et al. March 4, 2 | 2003-03-04 |
| Compliant layer for encapsulated columns App 20030020150 - Jimarez, Lisa J. ; et al. | 2003-01-30 |
| Conductive adhesive interconnection with insulating polymer carrier Grant 6,458,623 - Goldmann , et al. October 1, 2 | 2002-10-01 |
| Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof App 20020127406 - Sachdev, Krishna G. ; et al. | 2002-09-12 |
| Compliant layer for encapsulated cloumns App 20020092676 - Jimarez, Lisa J. ; et al. | 2002-07-18 |
| Conductive adhesive interconnection with insulating polymer carrier App 20020093104 - Goldmann, Lewis S. ; et al. | 2002-07-18 |
| Metal buckling beam probe Grant 6,404,211 - Hamel , et al. June 11, 2 | 2002-06-11 |
| Conductive polymer interconnection configurations App 20020028327 - Perry, Charles H. ; et al. | 2002-03-07 |
| Segmented architecture for wafer test & burn-in App 20010050567 - Bachelder, Thomas W. ; et al. | 2001-12-13 |
| Segmented architecture for wafer test and burn-in Grant 6,275,051 - Bachelder , et al. August 14, 2 | 2001-08-14 |
| Metal Buckling Beam Probe App 20010011897 - HAMEL, HARVEY C. ; et al. | 2001-08-09 |
| Method of forming cavity substrates using compressive pads Grant 5,759,320 - Natarajan , et al. June 2, 1 | 1998-06-02 |
| Interface card for a probe card assembly Grant 5,629,631 - Perry , et al. May 13, 1 | 1997-05-13 |
| Semiconductor wafer test and burn-in Grant 5,600,257 - Leas , et al. February 4, 1 | 1997-02-04 |
| Probe card assembly having a ceramic probe card Grant 5,546,012 - Perry , et al. August 13, 1 | 1996-08-13 |
| Ceramic probe card and method for reducing leakage current Grant 5,532,608 - Behfar-Rad , et al. July 2, 1 | 1996-07-02 |
| Probe card assembly Grant 5,530,371 - Perry , et al. June 25, 1 | 1996-06-25 |
| One-way winch brake Grant 5,398,923 - Perry , et al. March 21, 1 | 1995-03-21 |
| Process for fabricating a low dielectric composite substrate Grant 5,277,725 - Acocella , et al. January 11, 1 | 1994-01-11 |
| Multilayer ceramic substrate with graded vias Grant 5,260,519 - Knickerbocker , et al. November 9, 1 | 1993-11-09 |
| Process for fabricating a low dielectric composite substrate Grant 5,135,595 - Acocella , et al. August 4, 1 | 1992-08-04 |
| Method and means for co-sintering ceramic/metal MLC substrates Grant 5,130,067 - Flaitz , et al. July 14, 1 | 1992-07-14 |
| Strengthening a ceramic by post sinter coating with a compressive surface layer Grant 4,781,970 - Barbee , et al. November 1, 1 | 1988-11-01 |
| Method for providing pinhole free dielectric layers Grant 4,519,851 - Perry , et al. May 28, 1 | 1985-05-28 |
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