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Perng; Ming-Hwei Patent Filings

Perng; Ming-Hwei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Perng; Ming-Hwei.The latest application filed is for "method for thickness calibration and measuring thickness of material".

Company Profile
0.4.5
  • Perng; Ming-Hwei - Hsinchu TW
  • PERNG; Ming-Hwei - Hsinchu City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Automatic search system and method
Grant 8,712,625 - Tsai , et al. April 29, 2
2014-04-29
Method for thickness calibration and measuring thickness of material
Grant 8,077,827 - Perng December 13, 2
2011-12-13
Method For Thickness Calibration And Measuring Thickness Of Material
App 20110206182 - PERNG; Ming-Hwei
2011-08-25
Detection Method And Detection System Of Moving Object
App 20110085026 - PERNG; Ming-Hwei ;   et al.
2011-04-14
Method For Determining Ego-motion Of Moving Platform And Detection System
App 20110074927 - Perng; Ming-Hwei ;   et al.
2011-03-31
Automatic Search System And Method
App 20110046838 - Tsai; Hung-Yin ;   et al.
2011-02-24
Q-space sampling method and diffusion spectrum imaging method employing the same
Grant 7,495,440 - Chiang , et al. February 24, 2
2009-02-24
Q-space Sampling Method And Diffusion Spectrum Imaging Method Employing The Same
App 20080272781 - CHIANG; Wen-Yang ;   et al.
2008-11-06

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