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name:-0.0068080425262451
name:-0.0074419975280762
name:-0.00045514106750488
Periasamy; Ganesh Vetrivel Patent Filings

Periasamy; Ganesh Vetrivel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Periasamy; Ganesh Vetrivel.The latest application filed is for "system and method for an electronic package with a fail-open mechanism".

Company Profile
0.6.6
  • Periasamy; Ganesh Vetrivel - Singapore N/A SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System and method for an electronic package with a fail-open mechanism
Grant 8,816,390 - Marbella , et al. August 26, 2
2014-08-26
System And Method For An Electronic Package With A Fail-open Mechanism
App 20130194752 - Marbella; Carlo Baterna ;   et al.
2013-08-01
RF and MMIC stackable micro-modules
Grant 7,592,703 - Kripesh , et al. September 22, 2
2009-09-22
RF and MMIC stackable micro-modules
App 20070222083 - Kripesh; Vaidyanathan ;   et al.
2007-09-27
RF and MMIC stackable micro-modules
Grant 7,230,318 - Kripesh , et al. June 12, 2
2007-06-12
Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
Grant 7,160,756 - Kripesh , et al. January 9, 2
2007-01-09
Method for ultra thinning bumped wafers for flip chip
Grant 7,141,487 - Periasamy , et al. November 28, 2
2006-11-28
Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices
App 20060079025 - Kripesh; Vaidyanathan ;   et al.
2006-04-13
Method for ultra thinning bumped wafers for flip chip
App 20060003550 - Periasamy; Ganesh Vetrivel ;   et al.
2006-01-05
RF and MMIC stackable micro-modules
App 20050146049 - Kripesh, Vaidyanathan ;   et al.
2005-07-07

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