Periaman; Shanggar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Periaman; Shanggar.The latest application filed is for "stacked package assembly with voltage reference plane".

Company Profile

1.23.27

Periaman; Shanggar - Gelugor MY
Periaman; Shanggar - Penang MY
Periaman; Shanggar - Georgetown MY
Periaman; Shanggar - Butterworth MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked package assembly with voltage reference plane Grant 10,403,604 - Cheah , et al. Sep	2019-09-03
Flexible packaging architecture Grant 10,396,038 - Cheah , et al. A	2019-08-27
Stacked Package Assembly With Voltage Reference Plane App 20180294252 - CHEAH; Bok Eng ; et al.	2018-10-11
High Density Second Level Interconnection For Bumpless Build Up Layer (bbul) Packaging Technology App 20180145014 - Cheah; Bok Eng ; et al.	2018-05-24
Flexible Packaging Architecture App 20170345763 - CHEAH; Bok Eng ; et al.	2017-11-30
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same Grant 9,812,425 - Cheah , et al. November 7, 2	2017-11-07
Flexible system-in-package solutions for wearable devices Grant 9,778,688 - Tang , et al. October 3, 2	2017-10-03
High density second level interconnection for bumpless build up layer (BBUL) packaging technology Grant 9,721,878 - Cheah , et al. August 1, 2	2017-08-01
Integrated circuit packaging techniques and configurations for small form-factor or wearable devices Grant 9,646,953 - Kong , et al. May 9, 2	2017-05-09
Multi-die Semiconductor Structure With Intermediate Vertical Side Chip And Semiconductor Package For Same App 20170018530 - CHEAH; Bok Eng ; et al.	2017-01-19
Integrated Circuit Packaging Techniques And Configurations For Small Form-factor Or Wearable Devices App 20160343686 - Kong; Jackson Chung Peng ; et al.	2016-11-24
Flexible System-in-package Solutions For Wearable Devices App 20160327977 - Tang; Jiamiao ; et al.	2016-11-10
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same Grant 9,478,524 - Cheah , et al. October 25, 2	2016-10-25
Multi-die Semiconductor Structure With Intermediate Vertical Side Chip And Semiconductor Package For Same App 20160005718 - CHEAH; Bok Eng ; et al.	2016-01-07
Method to enable controlled side chip interconnection for 3D integrated packaging system Grant 9,136,251 - Cheah , et al. September 15, 2	2015-09-15
High-density Inter-package Connections For Ultra-thin Package-on-package Structures, And Processes Of Forming Same App 20150201497 - Cheah; Bok Eng ; et al.	2015-07-16
High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same Grant 8,987,896 - Cheah , et al. March 24, 2	2015-03-24
Stacked Die Package App 20140175670 - Cheah; Bok Eng ; et al.	2014-06-26
Stacked die package Grant 8,697,495 - Cheah , et al. April 15, 2	2014-04-15
High Density Second Level Interconnection For Bumpless Build Up Layer (bbul) Packaging Technology App 20140091442 - Cheah; Bok Eng ; et al.	2014-04-03
Microelectronic Device, Stacked Die Package And Computing System Containing Same, Method Of Manufacturing A Multi-channel Communication Pathway In Same, And Method Of Enabling Electrical Communication Between Components Of A Stacked-die Package App 20120319293 - Cheah; Bok Eng ; et al.	2012-12-20
Firmware verification using system memory error check logic Grant 8,281,229 - Chew , et al. October 2, 2	2012-10-02
Die backside wire bond technology for single or stacked die package Grant 8,198,716 - Periaman , et al. June 12, 2	2012-06-12
Die backside metallization and surface activated bonding for stacked die packages Grant 8,110,930 - Periaman , et al. February 7, 2	2012-02-07
Stacked Die Package App 20120003792 - CHEAH; Bok Eng ; et al.	2012-01-05
Stacked die package Grant 8,044,497 - Cheah , et al. October 25, 2	2011-10-25
High-density Inter-package Connections For Ultra-thin Package-on-package Structures, And Processes Of Forming Same App 20110140268 - Cheah; Bok Eng ; et al.	2011-06-16
Bandwidth allocation for network packet traffic Grant 7,773,504 - Chew , et al. August 10, 2	2010-08-10
Firmware Verification Using System Memory Error Check Logic App 20100169750 - Chew; Yen Hsiang ; et al.	2010-07-01
Quality of service (QoS) processing of data packets Grant 7,743,181 - Chew , et al. June 22, 2	2010-06-22
Stacked-die packages with silicon vias and surface activated bonding Grant 7,692,278 - Periaman , et al. April 6, 2	2010-04-06
Bandwidth allocation for network packet traffic App 20090122702 - Chew; Yen Hsiang ; et al.	2009-05-14
Stacked Die Package App 20090065951 - CHEAH; Bok Eng ; et al.	2009-03-12
Quality of Service (QoS) Processing of Data Packets App 20090019196 - Chew; Yen Hsiang ; et al.	2009-01-15
Die backside metallization and surface activated bonding for stacked die packages App 20080315421 - Periaman; Shanggar ; et al.	2008-12-25
Vertical Controlled Side Chip Connection For 3d Processor Package App 20080315388 - Periaman; Shanggar ; et al.	2008-12-25
Die backside wire bond technology for single or stacked die package App 20080237310 - Periaman; Shanggar ; et al.	2008-10-02
Package on package design to improve functionality and efficiency Grant 7,400,033 - Cheah , et al. July 15, 2	2008-07-15
Package On Package Design To Improve Functionality And Efficiency App 20080157350 - Cheah; Bok Eng ; et al.	2008-07-03
Stacked-die packages with silicon vias and surface activated bonding App 20080150155 - Periaman; Shanggar ; et al.	2008-06-26
Stacked die semiconductor package Grant 7,279,795 - Periaman , et al. October 9, 2	2007-10-09
Stacked die semiconductor package App 20070152313 - Periaman; Shanggar ; et al.	2007-07-05

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