Perez; Roman

Patent Applications and Registrations

Patent applications and USPTO patent grants for Perez; Roman.The latest application filed is for "preparation method of core-shell structured fibrous scaffolds".

Company Profile

0.5.8

Perez; Roman - Cheonan-si KR
Perez; Roman - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Preparation method of core-shell structured fibrous scaffolds Grant 10,322,210 - Kim , et al.	2019-06-18
Preparation Method Of Core-shell Structured Fibrous Scaffolds App 20140186413 - KIM; Hae-Won ; et al.	2014-07-03
Package design and method of manufacture for chip grid array Grant 7,456,496 - Hwee , et al. November 25, 2	2008-11-25
Package design and method of manufacture for chip grid array App 20050205987 - Hwee, Tan Kim ; et al.	2005-09-22
Package design and method of manufacture for chip grid array Grant 6,929,981 - Hwee , et al. August 16, 2	2005-08-16
Flip chip package using no-flow underfill and method of fabrication App 20050087883 - Hwee, Tan Kim ; et al.	2005-04-28
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip Grant 6,750,082 - Briar , et al. June 15, 2	2004-06-15
Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture App 20040108580 - Tan, Kim Hwee ; et al.	2004-06-10
Semiconductor chip grid array package design and method of manufacture Grant 6,734,039 - Hwee , et al. May 11, 2	2004-05-11
Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly App 20040084508 - Briar, John ; et al.	2004-05-06
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip App 20040053445 - Briar, John ; et al.	2004-03-18
Semiconductor chip grid array package design and method of manufacture App 20040046238 - Hwee, Tan Kim ; et al.	2004-03-11
Package design and method of manufacture for chip grid array App 20040046257 - Hwee, Tan Kim ; et al.	2004-03-11

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