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Patent applications and USPTO patent grants for Pepe, Angel A..The latest application filed is for "stacked microelectronic module with vertical interconnect vias".
Patent | Date |
---|---|
Stacked microelectronic module with vertical interconnect vias App 20040113222 - Ozguz, Volkan H. ;   et al. | 2004-06-17 |
Dry adhesive joining of layers of electronic devices Grant 5,635,010 - Pepe , et al. June 3, 1 | 1997-06-03 |
Fabrication of dense parallel solder bump connections Grant 5,406,701 - Pepe , et al. April 18, 1 | 1995-04-18 |
Method for fabricating stacks of IC chips by segmenting a larger stack Grant 5,279,991 - Minahan , et al. January 18, 1 | 1994-01-18 |
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