PEP INNOVATION PTE. LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for PEP INNOVATION PTE. LTD..The latest application filed is for "semiconductor structures with via openings and methods of making the same".

Company Profile

17.16.19

PEP INNOVATION PTE. LTD. - Singapore SG
PEP INNOVATION PTE. LTD. - N/A
PEP INNOVATION PTE LTD - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Structures With Via Openings And Methods Of Making The Same App 20220157750 - Chew; Hwee Seng	2022-05-19
Chip Packaging Method And Chip Structure App 20220102254 - CHEW; Hwee Seng	2022-03-31
Chip packaging method and package structure Grant 11,232,957 - Chew January 25, 2	2022-01-25
Chip packaging method and chip structure Grant 11,233,028 - Chew January 25, 2	2022-01-25
Chip Packaging Method And Package Structure App 20210398822 - CHEW; JIMMY	2021-12-23
Semiconductor Device With Buffer Layer App 20210343549 - CHEW; Hwee Seng Jimmy ; et al.	2021-11-04
Method Of Packaging Chip And Chip Package Structure App 20210305064 - CHEW; Hwee Seng Jimmy	2021-09-30
Chip packaging method and package structure Grant 11,114,315 - Chew September 7, 2	2021-09-07
Packaging method, panel assembly, wafer package and chip package Grant 11,062,917 - Chew July 13, 2	2021-07-13
Method of packaging chip and chip package structure Grant 11,049,734 - Chew June 29, 2	2021-06-29
Semiconductor packaging method, semiconductor package and stacked semiconductor packages Grant 10,854,531 - Chew December 1, 2	2020-12-01
Packaging Method, Panel Assembly, Wafer Package And Chip Package App 20200312762 - CHEW; JIMMY	2020-10-01
Packaging Method, Panel Assembly, Wafer Package And Chip Package App 20200312676 - CHEW; JIMMY	2020-10-01
Chip Packaging Method And Package Structure App 20200203296 - CHEW; JIMMY	2020-06-25
Chip Packaging Method And Package Structure App 20200203188 - CHEW; JIMMY	2020-06-25
Chip Packaging Method And Package Structure App 20200203187 - CHEW; Jimmy	2020-06-25
Chip Packaging Method And Chip Structure App 20200203302 - CHEW; JIMMY	2020-06-25
Method of packaging chip and chip package structure Grant 10,615,056 - Chew	2020-04-07
Semiconductor processing method Grant 10,504,850 - Chew Dec	2019-12-10
Method Of Packaging Chip And Chip Package Structure App 20190371626 - CHEW; Hwee Seng Jimmy	2019-12-05
Method of packaging chip and chip package structure Grant 10,431,477 - Chew O	2019-10-01
Semiconductor Processing Method App 20180233455 - Chew; Yi Xin	2018-08-16
Semiconductor Package And Method Of Forming Thereof App 20180204741 - CHEW; Hwee Seng Jimmy	2018-07-19
Semiconductor Packaging Method, Semiconductor Package And Stacked Semiconductor Packages App 20180190513 - CHEW; Yi Xin	2018-07-05
Method Of Packaging Chip And Chip Package Structure App 20180151393 - CHEW; Hwee Seng Jimmy	2018-05-31
Semiconductor Package For 3d Stacking And Method Of Forming Thereof App 20180151392 - CHEW; Hwee Seng Jimmy	2018-05-31

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