| Patent | Date |
|---|
Single-mask alternating line deposition
Grant 11,437,317 - Anderson , et al. September 6, 2 | 2022-09-06 |
Barrier removal for conductor in top via integration scheme
Grant 11,430,735 - Anderson , et al. August 30, 2 | 2022-08-30 |
Top Via On Subtractively Etched Conductive Line
App 20220223473 - Anderson; Brent ; et al. | 2022-07-14 |
Creating different width lines and spaces in a metal layer
Grant 11,373,880 - Penny , et al. June 28, 2 | 2022-06-28 |
Conductive Lines With Subtractive Cuts
App 20220181255 - Anderson; Brent ; et al. | 2022-06-09 |
Optically-passive magnetic signature and identification feature with electromagnetic tamper detection
Grant 11,351,811 - Rizzolo , et al. June 7, 2 | 2022-06-07 |
Horizontal Rram Device And Architecture Fore Variability Reduction
App 20220173313 - Philip; Timothy Mathew ; et al. | 2022-06-02 |
Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather
Grant 11,348,060 - Briggs , et al. May 31, 2 | 2022-05-31 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 11,348,872 - Briggs , et al. May 31, 2 | 2022-05-31 |
Interconnects Having Spacers For Improved Top Via Critical Dimension And Overlay Tolerance
App 20220157652 - Anderson; Brent A. ; et al. | 2022-05-19 |
Stepped Top Via For Via Resistance Reduction
App 20220130718 - Anderson; Brent Alan ; et al. | 2022-04-28 |
Skip via connection between metallization levels
Grant 11,315,827 - Huang , et al. April 26, 2 | 2022-04-26 |
Subtractive line with damascene second line type
Grant 11,302,575 - Anderson , et al. April 12, 2 | 2022-04-12 |
Language learning and speech enhancement through natural language processing
Grant 11,302,205 - Amin , et al. April 12, 2 | 2022-04-12 |
Fully Aligned Top Vias
App 20220108922 - Lanzillo; Nicholas Anthony ; et al. | 2022-04-07 |
Interconnects having spacers for improved top via critical dimension and overlay tolerance
Grant 11,295,978 - Anderson , et al. April 5, 2 | 2022-04-05 |
Top vias with selectively retained etch stops
Grant 11,289,371 - Anderson , et al. March 29, 2 | 2022-03-29 |
Creating Different Width Lines And Spaces In A Metal Layer
App 20220093414 - Penny; Christopher J ; et al. | 2022-03-24 |
Conductive lines with subtractive cuts
Grant 11,276,639 - Anderson , et al. March 15, 2 | 2022-03-15 |
Proximity correction in three-dimensional manufacturing
Grant 11,263,068 - Briggs , et al. March 1, 2 | 2022-03-01 |
Load leveler
Grant 11,263,059 - Fry , et al. March 1, 2 | 2022-03-01 |
Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line
Grant 11,244,859 - Motoyama , et al. February 8, 2 | 2022-02-08 |
Subtractive Line with Damascene Second Line Type
App 20220037205 - Anderson; Brent ; et al. | 2022-02-03 |
Top Via Stack
App 20220028783 - Anderson; Brent Alan ; et al. | 2022-01-27 |
Top Via Interconnect Having A Line With A Reduced Bottom Dimension
App 20220028785 - Anderson; Brent ; et al. | 2022-01-27 |
Stepped top via for via resistance reduction
Grant 11,232,977 - Anderson , et al. January 25, 2 | 2022-01-25 |
Self-aligned pattern formation for a semiconductor device
Grant 11,227,793 - Burns , et al. January 18, 2 | 2022-01-18 |
Top Via With Damascene Line And Via
App 20220005732 - Clevenger; Lawrence A. ; et al. | 2022-01-06 |
Top Via With Next Level Line Selective Growth
App 20220005761 - Anderson; Brent ; et al. | 2022-01-06 |
Etch Stop Layer Removal For Capacitance Reduction In Damascene Top Via Integration
App 20220005731 - Penny; Christopher J. ; et al. | 2022-01-06 |
Fully aligned top vias
Grant 11,217,481 - Lanzillo , et al. January 4, 2 | 2022-01-04 |
Behavior-based interactive educational sessions
Grant 11,210,968 - Clevenger , et al. December 28, 2 | 2021-12-28 |
Well-controlled Edge-to-edge Spacing Between Adjacent Interconnects
App 20210384123 - Anderson; Brent ; et al. | 2021-12-09 |
Top via stack
Grant 11,195,792 - Anderson , et al. December 7, 2 | 2021-12-07 |
Well-controlled edge-to-edge spacing between adjacent interconnects
Grant 11,195,795 - Anderson , et al. December 7, 2 | 2021-12-07 |
Optically-passive Magnetic Signature And Identification Feature With Electromagnetic Tamper Detection
App 20210370705 - Rizzolo; Michael ; et al. | 2021-12-02 |
Top via interconnect having a line with a reduced bottom dimension
Grant 11,189,568 - Anderson , et al. November 30, 2 | 2021-11-30 |
Trapezoidal interconnect at tight BEOL pitch
Grant 11,177,162 - Lanzillo , et al. November 16, 2 | 2021-11-16 |
Etch stop layer removal for capacitance reduction in damascene top via integration
Grant 11,177,166 - Penny , et al. November 16, 2 | 2021-11-16 |
Top via with next level line selective growth
Grant 11,171,084 - Anderson , et al. November 9, 2 | 2021-11-09 |
Barrier-less Prefilled Via Formation
App 20210343589 - Lanzillo; Nicholas Anthony ; et al. | 2021-11-04 |
Top Via Interconnect Having A Line With A Reduced Bottom Dimension
App 20210343643 - Anderson; Brent ; et al. | 2021-11-04 |
Interconnects Having Spacers For Improved Top Via Critical Dimension And Overlay Tolerance
App 20210343585 - Anderson; Brent ; et al. | 2021-11-04 |
Top via with damascene line and via
Grant 11,164,777 - Clevenger , et al. November 2, 2 | 2021-11-02 |
Motion-controlled portals in virtual reality
Grant 11,164,377 - Sipolins , et al. November 2, 2 | 2021-11-02 |
Semiconductor Device Including A Porous Dielectric Layer, And Method Of Forming The Semiconductor Device
App 20210335706 - Briggs; Benjamin D. ; et al. | 2021-10-28 |
Top vias with subtractive line formation
Grant 11,158,537 - Anderson , et al. October 26, 2 | 2021-10-26 |
Etch Stop Layer Removal For Capacitance Reduction In Damascene Top Via Integration
App 20210327751 - Penny; Christopher J. ; et al. | 2021-10-21 |
Hybrid selective dielectric deposition for aligned via integration
Grant 11,152,299 - Lanzillo , et al. October 19, 2 | 2021-10-19 |
Barrier-less prefilled via formation
Grant 11,152,257 - Lanzillo , et al. October 19, 2 | 2021-10-19 |
Top Via With Next Level Line Selective Growth
App 20210313265 - Anderson; Brent ; et al. | 2021-10-07 |
Secure access for drone package delivery
Grant 11,138,890 - Briggs , et al. October 5, 2 | 2021-10-05 |
Top via with hybrid metallization
Grant 11,139,201 - Motoyama , et al. October 5, 2 | 2021-10-05 |
Top Via On Subtractively Etched Conductive Line
App 20210296171 - Anderson; Brent ; et al. | 2021-09-23 |
Hybrid Selective Dielectric Deposition For Aligned Via Integration
App 20210280510 - Lanzillo; Nicholas Anthony ; et al. | 2021-09-09 |
Skip Via Connection Between Metallization Levels
App 20210280456 - Huang; Huai ; et al. | 2021-09-09 |
Self Aligned Pattern Formation Post Spacer Etchback In Tight Pitch Configurations
App 20210280422 - Burns; Sean D. ; et al. | 2021-09-09 |
Smart display apparatus and control system
Grant 11,113,533 - Bergendahl , et al. September 7, 2 | 2021-09-07 |
Barrier Removal For Conductor In Top Via Integration Scheme
App 20210257308 - Anderson; Brent Alan ; et al. | 2021-08-19 |
Single-mask Alternating Line Deposition
App 20210249351 - Anderson; Brent Alan ; et al. | 2021-08-12 |
Stepped Top Via For Via Resistance Reduction
App 20210249302 - Anderson; Brent Alan ; et al. | 2021-08-12 |
Top Vias With Selectively Retained Etch Stops
App 20210233807 - Anderson; Brent ; et al. | 2021-07-29 |
Top Vias With Subtractive Line Formation
App 20210233808 - Anderson; Brent ; et al. | 2021-07-29 |
Barrier-less Prefilled Via Formation
App 20210225700 - Lanzillo; Nicholas Anthony ; et al. | 2021-07-22 |
Conductive Lines With Subtractive Cuts
App 20210225761 - Anderson; Brent ; et al. | 2021-07-22 |
Top Via Stack
App 20210217696 - Anderson; Brent Alan ; et al. | 2021-07-15 |
Top Via With Damascene Line And Via
App 20210217661 - Clevenger; Lawrence A. ; et al. | 2021-07-15 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20210217653 - Penny; Christopher J. ; et al. | 2021-07-15 |
Top via interconnects with wrap around liner
Grant 11,062,943 - Motoyama , et al. July 13, 2 | 2021-07-13 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
Grant 11,056,429 - Briggs , et al. July 6, 2 | 2021-07-06 |
Self aligned pattern formation post spacer etchback in tight pitch configurations
Grant 11,018,007 - Burns , et al. May 25, 2 | 2021-05-25 |
Fully Aligned Top Vias
App 20210143062 - Lanzillo; Nicholas Anthony ; et al. | 2021-05-13 |
Blockchain stochastic timer transaction synchronization
Grant 11,005,646 - Fry , et al. May 11, 2 | 2021-05-11 |
Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material
Grant 11,004,790 - Briggs , et al. May 11, 2 | 2021-05-11 |
Top Via With Hybrid Metallization
App 20210134664 - Motoyama; Koichi ; et al. | 2021-05-06 |
Interconnects Having A Via-to-line Spacer For Preventing Short Circuit Events Between A Conductive Via And An Adjacent Line
App 20210111069 - Motoyama; Koichi ; et al. | 2021-04-15 |
Language Learning And Speech Enhancement Through Natural Language Processing
App 20210110727 - Amin; Mahmoud ; et al. | 2021-04-15 |
Interconnect structure having fully aligned vias
Grant 10,978,343 - Park , et al. April 13, 2 | 2021-04-13 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 10,978,393 - Briggs , et al. April 13, 2 | 2021-04-13 |
Remote physical training
Grant 10,971,030 - Briggs , et al. April 6, 2 | 2021-04-06 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,964,588 - Penny , et al. March 30, 2 | 2021-03-30 |
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs
Grant 10,957,583 - Burns , et al. March 23, 2 | 2021-03-23 |
Trapezoidal Interconnect at Tight BEOL Pitch
App 20210082744 - Lanzillo; Nicholas Anthony ; et al. | 2021-03-18 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,943,866 - Briggs , et al. March 9, 2 | 2021-03-09 |
Interconnect Structure Having Fully Aligned Vias
App 20210050260 - Park; Chanro ; et al. | 2021-02-18 |
Top Via Interconnects With Wrap Around Liner
App 20210043507 - Motoyama; Koichi ; et al. | 2021-02-11 |
Language learning and speech enhancement through natural language processing
Grant 10,916,154 - Amin , et al. February 9, 2 | 2021-02-09 |
Self-forming Barrier For Use In Air Gap Formation
App 20200402849 - Briggs; Benjamin D. ; et al. | 2020-12-24 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20200388525 - Penny; Christopher J. ; et al. | 2020-12-10 |
Semiconductor Device Including A Porous Dielectric Layer, And Method Of Forming The Semiconductor Device
App 20200388568 - Briggs; Benjamin David ; et al. | 2020-12-10 |
Capacitors
Grant 10,833,149 - Basker , et al. November 10, 2 | 2020-11-10 |
Semiconductor Device With Selective Insulator For Improved Capacitance
App 20200303239 - Penny; Christopher J. ; et al. | 2020-09-24 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,784,197 - Briggs , et al. Sept | 2020-09-22 |
Self-aligned airgaps with conductive lines and vias
Grant 10,784,156 - Briggs , et al. Sept | 2020-09-22 |
Binaural audio calibration
Grant 10,785,590 - Briggs , et al. Sept | 2020-09-22 |
Selective dielectric deposition to prevent gouging in MRAM
Grant 10,770,653 - Penny , et al. Sep | 2020-09-08 |
Self-forming barrier for use in air gap formation
Grant 10,763,166 - Briggs , et al. Sep | 2020-09-01 |
Semiconductor device with selective insulator for improved capacitance
Grant 10,763,160 - Penny , et al. Sep | 2020-09-01 |
Capacitance reduction in sea of lines BEOL metallization
Grant 10,679,934 - Briggs , et al. | 2020-06-09 |
System and method for performing nano beam diffraction analysis
Grant 10,658,154 - Bergendahl , et al. | 2020-05-19 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,651,078 - Penny , et al. | 2020-05-12 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
Grant 10,629,529 - Briggs , et al. | 2020-04-21 |
Dual-damascene formation with dielectric spacer and thin liner
Grant 10,629,478 - Briggs , et al. | 2020-04-21 |
Metal insulator metal capacitor devices
Grant 10,629,428 - Siddiqui , et al. | 2020-04-21 |
Computer-mediated reality including physical damping feedback
Grant 10,606,231 - Briggs , et al. | 2020-03-31 |
Self-aligned Pattern Formation For A Semiconductor Device
App 20200090985 - Burns; Sean D. ; et al. | 2020-03-19 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20200091079 - Briggs; Benjamin D. ; et al. | 2020-03-19 |
Behavior-based Interactive Educational Sessions
App 20200090542 - Clevenger; Lawrence A. ; et al. | 2020-03-19 |
Load Leveler
App 20200081746 - Fry; Jonathan ; et al. | 2020-03-12 |
Proximity Correction In Three-dimensional Manufacturing
App 20200081761 - Briggs; Benjamin D. ; et al. | 2020-03-12 |
Self Aligned Pattern Formation Post Spacer Etchback In Tight Pitch Configurations
App 20200075336 - Burns; Sean D. ; et al. | 2020-03-05 |
Increasing Cost Benefit And Energy Efficiency With Modular Delivery Drones In Inclement Weather
App 20200065762 - Briggs; Benjamin D. ; et al. | 2020-02-27 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20200058590 - Briggs; Benjamin D. ; et al. | 2020-02-20 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20200058591 - Briggs; Benjamin D. ; et al. | 2020-02-20 |
BEOL capacitor through airgap metallization
Grant 10,566,414 - Bergendahl , et al. Feb | 2020-02-18 |
Interconnect formation with chamferless via, and related interconnect
Grant 10,566,231 - O'Toole , et al. Feb | 2020-02-18 |
BEOL vertical fuse formed over air gap
Grant 10,546,813 - Bergendahl , et al. Ja | 2020-01-28 |
Proximity correction in three-dimensional manufacturing
Grant 10,545,806 - Briggs , et al. Ja | 2020-01-28 |
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs
Grant 10,546,774 - Burns , et al. Ja | 2020-01-28 |
Smart Display Apparatus And Control System
App 20200026924 - Bergendahl; Marc A. ; et al. | 2020-01-23 |
Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer
Grant 10,541,206 - Briggs , et al. Ja | 2020-01-21 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20200013718 - Briggs; Benjamin D. ; et al. | 2020-01-09 |
Method and structure to construct cylindrical interconnects to reduce resistance
Grant 10,529,662 - Briggs , et al. J | 2020-01-07 |
Self aligned pattern formation post spacer etchback in tight pitch configurations
Grant 10,529,569 - Burns , et al. J | 2020-01-07 |
Smart display apparatus and control system
Grant 10,528,817 - Bergendahl , et al. J | 2020-01-07 |
Self-aligned Quadruple Patterning (saqp) For Routing Layouts Including Multi-track Jogs
App 20190393082 - Burns; Sean D. ; et al. | 2019-12-26 |
Binaural Audio Calibration
App 20190379996 - Briggs; Benjamin David ; et al. | 2019-12-12 |
Blockchain Stochastic Timer Transaction Synchronization
App 20190363873 - Fry; Jonathan ; et al. | 2019-11-28 |
Binaural audio calibration
Grant 10,492,019 - Briggs , et al. Nov | 2019-11-26 |
Motion-controlled Portals In Virtual Reality
App 20190355175 - Sipolins; Aldis ; et al. | 2019-11-21 |
BEOL capacitor through airgap metallization
Grant 10,475,878 - Bergendahl , et al. Nov | 2019-11-12 |
Interconnect Formation With Chamferless Via, And Related Interconnect
App 20190333805 - O'Toole; Martin J. ; et al. | 2019-10-31 |
BEOL vertical fuse formed over air gap
Grant 10,453,793 - Bergendahl , et al. Oc | 2019-10-22 |
Semiconductor Device Including a Porous Dielectric Layer, and Method of Forming the Semiconductor Device
App 20190279931 - Briggs; Benjamin David ; et al. | 2019-09-12 |
Metal Insulator Metal Capacitor Devices
App 20190279860 - SIDDIQUI; Shariq ; et al. | 2019-09-12 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20190267278 - Penny; Christopher J. ; et al. | 2019-08-29 |
Self aligned conductive lines with relaxed overlay
Grant 10,395,985 - Burns , et al. A | 2019-08-27 |
Multi-angled deposition and masking for custom spacer trim and selected spacer removal
Grant 10,388,525 - Bergendahl , et al. A | 2019-08-20 |
Method And Structure To Construct Cylindrical Interconnects To Reduce Resistance
App 20190237402 - Briggs; Benjamin D. ; et al. | 2019-08-01 |
Air gap and air spacer pinch off
Grant 10,366,940 - Bonilla , et al. July 30, 2 | 2019-07-30 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
Grant 10,366,952 - Briggs , et al. July 30, 2 | 2019-07-30 |
Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface
Grant 10,361,157 - Briggs , et al. | 2019-07-23 |
Selective ILD deposition for fully aligned via with airgap
Grant 10,361,117 - Penny , et al. | 2019-07-23 |
Multi-angled deposition and masking for custom spacer trim and selected spacer removal
Grant 10,361,079 - Bergendahl , et al. | 2019-07-23 |
Capacitors
App 20190214456 - BASKER; Veeraraghavan S. ; et al. | 2019-07-11 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications
Grant 10,347,825 - Briggs , et al. July 9, 2 | 2019-07-09 |
Selective Ild Deposition For Fully Aligned Via With Airgap
App 20190181033 - Penny; Christopher J. ; et al. | 2019-06-13 |
Smart Display Apparatus And Control System
App 20190180106 - Bergendahl; Marc A. ; et al. | 2019-06-13 |
Capacitance Reduction In Sea Of Lines Beol Metallization
App 20190172783 - Briggs; Benjamin D. ; et al. | 2019-06-06 |
Infant Gastrointestinal Monitor
App 20190167226 - Wynne; Jean ; et al. | 2019-06-06 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications
Grant 10,312,434 - Briggs , et al. | 2019-06-04 |
Secure Access For Drone Package Delivery
App 20190164441 - Briggs; Benjamin D. ; et al. | 2019-05-30 |
Self-forming Barrier For Use In Air Gap Formation
App 20190157146 - Briggs; Benjamin D. ; et al. | 2019-05-23 |
Computer-mediated Reality Including Physical Damping Feedback
App 20190155236 - Briggs; Benjamin D. ; et al. | 2019-05-23 |
Capacitors
Grant 10,283,586 - Basker , et al. | 2019-05-07 |
Drone Delivery Routing And Communication
App 20190122177 - BRIGGS; BENJAMIN D. ; et al. | 2019-04-25 |
Language Learning And Speech Enhancement Through Natural Language Processing
App 20190122574 - Amin; Mahmoud ; et al. | 2019-04-25 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 10,256,191 - Briggs , et al. | 2019-04-09 |
Air gap and air spacer pinch off
Grant 10,256,171 - Bonilla , et al. | 2019-04-09 |
Air gap and air spacer pinch off
Grant 10,242,933 - Bonilla , et al. | 2019-03-26 |
High-density MIM capacitors
Grant 10,229,967 - Briggs , et al. | 2019-03-12 |
Self-forming barrier for use in air gap formation
Grant 10,229,851 - Briggs , et al. | 2019-03-12 |
Dual-damascene Formation With Dielectric Spacer And Thin Liner
App 20190067087 - Briggs; Benjamin D. ; et al. | 2019-02-28 |
System and Method for Performing Nano Beam Diffraction Analysis
App 20190035599 - BERGENDAHL; Marc Adam ; et al. | 2019-01-31 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20190013278 - Briggs; Benjamin D. ; et al. | 2019-01-10 |
Air gap and air spacer pinch off
Grant 10,177,076 - Bonilla , et al. J | 2019-01-08 |
Capacitors
Grant 10,170,540 - Basker , et al. J | 2019-01-01 |
Airgap protection layer for via alignment
Grant 10,170,411 - Briggs , et al. J | 2019-01-01 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length
Grant 10,170,416 - Briggs , et al. J | 2019-01-01 |
Semiconductor Device Including A Porous Dielectric Layer, And Method Of Forming The Semiconductor Device
App 20180366408 - BRIGGS; Benjamin David ; et al. | 2018-12-20 |
Proximity Correction In Three-dimensional Manufacturing
App 20180349220 - Briggs; Benjamin D. ; et al. | 2018-12-06 |
Self Aligned Pattern Formation Post Spacer Etchback In Tight Pitch Configurations
App 20180350599 - Burns; Sean D. ; et al. | 2018-12-06 |
Beol Vertical Fuse Formed Over Air Gap
App 20180342458 - Bergendahl; Marc A. ; et al. | 2018-11-29 |
Self aligned pattern formation post spacer etchback in tight pitch configurations
Grant 10,121,661 - Burns , et al. November 6, 2 | 2018-11-06 |
System and method for performing nano beam diffraction analysis
Grant 10,109,455 - Bergendahl , et al. October 23, 2 | 2018-10-23 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
Grant 10,109,579 - Briggs , et al. October 23, 2 | 2018-10-23 |
BEOL vertical fuse formed over air gap
Grant 10,083,908 - Bergendahl , et al. September 25, 2 | 2018-09-25 |
Self aligned conductive lines with relaxed overlay
Grant 10,083,864 - Burns , et al. September 25, 2 | 2018-09-25 |
Skip-vias bypassing a metallization level at minimum pitch
Grant 10,083,905 - Briggs , et al. September 25, 2 | 2018-09-25 |
Binaural Audio Calibration
App 20180249271 - Briggs; Benjamin David ; et al. | 2018-08-30 |
Emotional Analysis And Depiction In Virtual Reality
App 20180247443 - Briggs; Benjamin D. ; et al. | 2018-08-30 |
Self-aligned Pattern Formation For A Semiconductor Device
App 20180247864 - Burns; Sean D. ; et al. | 2018-08-30 |
Selective Deposition And Nitridization Of Bottom Electrode Metal For Mram Applications
App 20180240971 - Briggs; Benjamin D. ; et al. | 2018-08-23 |
Beol Vertical Fuse Formed Over Air Gap
App 20180240752 - Bergendahl; Marc A. ; et al. | 2018-08-23 |
Selective Deposition And Nitridization Of Bottom Electrode Metal For Mram Applications
App 20180240968 - Briggs; Benjamin D. ; et al. | 2018-08-23 |
Self-aligned pattern formation for a semiconductor device
Grant 10,056,290 - Burns , et al. August 21, 2 | 2018-08-21 |
Self Aligned Conductive Lines With Relaxed Overlay
App 20180233408 - Burns; Sean D. ; et al. | 2018-08-16 |
Self-aligned Quadruple Patterning (saqp) For Routing Layouts Including Multi-track Jogs
App 20180233403 - Burns; Sean D. ; et al. | 2018-08-16 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20180211920 - Briggs; Benjamin D. ; et al. | 2018-07-26 |
Remote Physical Training
App 20180207484 - Briggs; Benjamin D. ; et al. | 2018-07-26 |
Self Aligned Pattern Formation Post Spacer Etchback In Tight Pitch Configurations
App 20180197738 - Burns; Sean D. ; et al. | 2018-07-12 |
Semiconductor Device Including A Porous Dielectric Layer, And Method Of Forming The Semiconductor Device
App 20180190585 - BRIGGS; Benjamin David ; et al. | 2018-07-05 |
System and Method for Performing Nano Beam Diffraction Analysis
App 20180190470 - BERGENDAHL; Marc Adam ; et al. | 2018-07-05 |
Multi-angled deposition and masking for custom spacer trim and selected spacer removal
Grant 10,002,762 - Bergendahl , et al. June 19, 2 | 2018-06-19 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
Grant 9,997,451 - Briggs , et al. June 12, 2 | 2018-06-12 |
BEOL vertical fuse formed over air gap
Grant 9,997,454 - Bergendahl , et al. June 12, 2 | 2018-06-12 |
Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs
Grant 9,991,156 - Burns , et al. June 5, 2 | 2018-06-05 |
Airgap Protection Layer For Via Alignment
App 20180151491 - Briggs; Benjamin D. ; et al. | 2018-05-31 |
System and method for performing nano beam diffraction analysis
Grant 9,978,560 - Bergendahl , et al. May 22, 2 | 2018-05-22 |
Aligning conductive vias with trenches
Grant 9,972,533 - Burns , et al. May 15, 2 | 2018-05-15 |
Fully aligned via with integrated air gaps
Grant 9,966,337 - Briggs , et al. May 8, 2 | 2018-05-08 |
Ion flow barrier structure for interconnect metallization
Grant 9,966,305 - Demarest , et al. May 8, 2 | 2018-05-08 |
BEOL Capacitor Through Airgap Metallization
App 20180122892 - Bergendahl; Marc A. ; et al. | 2018-05-03 |
Air gap semiconductor structure with selective cap bilayer
Grant 9,960,117 - Gates , et al. May 1, 2 | 2018-05-01 |
Skip-vias Bypassing A Metallization Level At Minimum Pitch
App 20180114752 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Selective Blocking Boundary Placement For Circuit Locations Requiring Electromigration Short-length
App 20180114750 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Air Gap And Air Spacer Pinch Off
App 20180108596 - Bonilla; Griselda ; et al. | 2018-04-19 |
Self aligned pattern formation post spacer etchback in tight pitch configurations
Grant 9,934,970 - Burns , et al. April 3, 2 | 2018-04-03 |
Heterogeneous Metallization Using Solid Diffusion Removal Of Metal Interconnects
App 20180090372 - Briggs; Benjamin D. ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090587 - Bonilla; Griselda ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090418 - Bonilla; Griselda ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090588 - Bonilla; Griselda ; et al. | 2018-03-29 |
Airgap protection layer for via alignment
Grant 9,929,088 - Briggs , et al. March 27, 2 | 2018-03-27 |
Self-aligned Airgaps With Conductive Lines And Vias
App 20180082885 - Briggs; Benjamin D. ; et al. | 2018-03-22 |
Multi-angled Deposition And Masking For Custom Spacer Trim And Selected Spacer Removal
App 20180076035 - Bergendahl; Marc A. ; et al. | 2018-03-15 |
Multi-angled Deposition And Masking For Custom Spacer Trim And Selected Spacer Removal
App 20180076034 - Bergendahl; Marc A. ; et al. | 2018-03-15 |
Multi-angled Deposition And Masking For Custom Spacer Trim And Selected Spacer Removal
App 20180076033 - Bergendahl; Marc A. ; et al. | 2018-03-15 |
Self aligned conductive lines
Grant 9,911,647 - Burns , et al. March 6, 2 | 2018-03-06 |
Skip-vias bypassing a metallization level at minimum pitch
Grant 9,911,651 - Briggs , et al. March 6, 2 | 2018-03-06 |
Self-forming Barrier For Use In Air Gap Formation
App 20180061708 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
BEOL Capacitor Through Airgap Metallization
App 20180061933 - Bergendahl; Marc A. ; et al. | 2018-03-01 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length
Grant 9,905,513 - Briggs , et al. February 27, 2 | 2018-02-27 |
Structure and fabrication method for enhanced mechanical strength crack stop
Grant 9,899,338 - Briggs , et al. February 20, 2 | 2018-02-20 |
Self-aligned airgaps with conductive lines and vias
Grant 9,899,256 - Briggs , et al. February 20, 2 | 2018-02-20 |
Structure And Fabrication Method For Enhanced Mechanical Strength Crack Stop
App 20180047676 - Briggs; Benjamin D. ; et al. | 2018-02-15 |
Aligning Conductive Vias With Trenches
App 20180025943 - Burns; Sean D. ; et al. | 2018-01-25 |
Self Aligned Conductive Lines With Relaxed Overlay
App 20180005885 - Burns; Sean D. ; et al. | 2018-01-04 |
System And Method For Performing Nano Beam Diffraction Analysis
App 20180005798 - BERGENDAHL; Marc Adam ; et al. | 2018-01-04 |
Self-aligned Pattern Formation For A Semiconductor Device
App 20180005875 - Burns; Sean D. ; et al. | 2018-01-04 |
Semiconductor Device Including A Porous Dielectric Layer, And Method Of Forming The Semiconductor Device
App 20180005941 - BRIGGS; Benjamin David ; et al. | 2018-01-04 |
Self-aligned Airgaps With Conductive Lines And Vias
App 20180005868 - Briggs; Benjamin D. ; et al. | 2018-01-04 |
Self aligned conductive lines
Grant 9,852,946 - Burns , et al. December 26, 2 | 2017-12-26 |
Self Aligned Conductive Lines
App 20170358492 - Burns; Sean D. ; et al. | 2017-12-14 |
Self Aligned Conductive Lines
App 20170358487 - Burns; Sean D. ; et al. | 2017-12-14 |
Self-aligned Quadruple Patterning (saqp) For Routing Layouts Including Multi-track Jogs
App 20170352585 - Burns; Sean D. ; et al. | 2017-12-07 |
Forming deep airgaps without flop over
Grant 9,837,305 - Briggs , et al. December 5, 2 | 2017-12-05 |
High-density MIM capacitors
Grant 9,837,485 - Briggs , et al. December 5, 2 | 2017-12-05 |
Method for maximizing air gap in back end of the line interconnect through via landing modification
Grant 9,837,355 - Briggs , et al. December 5, 2 | 2017-12-05 |
Structure and fabrication method for enhanced mechanical strength crack stop
Grant 9,824,982 - Briggs , et al. November 21, 2 | 2017-11-21 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20170317025 - Briggs; Benjamin D. ; et al. | 2017-11-02 |
High-density Mim Capacitors
App 20170301749 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
Airgap Protection Layer For Via Alignment
App 20170301621 - Briggs; Benjamin D. ; et al. | 2017-10-19 |
Heterogeneous metallization using solid diffusion removal of metal interconnects
Grant 9,793,206 - Briggs , et al. October 17, 2 | 2017-10-17 |
Ion flow barrier structure for interconnect metallization
Grant 9,793,213 - Demarest , et al. October 17, 2 | 2017-10-17 |
Air gap and air spacer pinch off
Grant 9,793,193 - Bonilla , et al. October 17, 2 | 2017-10-17 |
Self aligned conductive lines
Grant 9,786,554 - Burns , et al. October 10, 2 | 2017-10-10 |
Air gap and air spacer pinch off
Grant 9,786,760 - Bonilla , et al. October 10, 2 | 2017-10-10 |
High-density Mim Capacitors
App 20170288011 - Briggs; Benjamin D. ; et al. | 2017-10-05 |
Hybrid airgap structure with oxide liner
Grant 9,780,027 - Bergendahl , et al. October 3, 2 | 2017-10-03 |
Method and structure for cut material selection
Grant 9,779,944 - Burns , et al. October 3, 2 | 2017-10-03 |
Method for Maximizing Air Gap in Back End of the Line Interconnect through Via Landing Modification
App 20170278796 - Briggs; Benjamin D. ; et al. | 2017-09-28 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20170278740 - Briggs; Benjamin D. ; et al. | 2017-09-28 |
Structure And Method For Maximizing Air Gap In Back End Of The Line Interconnect Through Via Landing Modification
App 20170278788 - Briggs; Benjamin D. ; et al. | 2017-09-28 |
Aligning conductive vias with trenches
Grant 9,773,700 - Burns , et al. September 26, 2 | 2017-09-26 |
Beol Vertical Fuse Formed Over Air Gap
App 20170243822 - Bergendahl; Marc A. ; et al. | 2017-08-24 |
Beol Vertical Fuse Formed Over Air Gap
App 20170243821 - Bergendahl; Marc A. ; et al. | 2017-08-24 |
Ion Flow Barrier Structure For Interconnect Metallization
App 20170236784 - Demarest; James J. ; et al. | 2017-08-17 |
Ion Flow Barrier Structure For Interconnect Metallization
App 20170236748 - Demarest; James J. ; et al. | 2017-08-17 |
Method of forming an air gap semiconductor structure with selective cap bilayer
Grant 9,711,455 - Gates , et al. July 18, 2 | 2017-07-18 |
Forming chamferless vias using thermally decomposable porefiller
Grant 9,685,366 - Briggs , et al. June 20, 2 | 2017-06-20 |
BEOL vertical fuse formed over air gap
Grant 9,666,528 - Bergendahl , et al. May 30, 2 | 2017-05-30 |
Method and structure to reduce the electric field in semiconductor wiring interconnects
Grant 9,666,529 - Huang , et al. May 30, 2 | 2017-05-30 |
Hybrid Airgap Structure With Oxide Liner
App 20170141030 - Bergendahl; Marc A. ; et al. | 2017-05-18 |
Capacitors
App 20170141184 - BASKER; Veeraraghavan S. ; et al. | 2017-05-18 |
Capacitors
Grant 9,607,943 - Basker , et al. March 28, 2 | 2017-03-28 |
Self aligned conductive lines with relaxed overlay
Grant 9,607,886 - Burns , et al. March 28, 2 | 2017-03-28 |
Airgap protection layer for via alignment
Grant 9,553,019 - Briggs , et al. January 24, 2 | 2017-01-24 |
Capacitors
App 20160365312 - BASKER; Veeraraghavan S. ; et al. | 2016-12-15 |
Capacitors
App 20160365314 - BASKER; Veeraraghavan S. ; et al. | 2016-12-15 |
Hybrid airgap structure with oxide liner
Grant 9,449,871 - Bergendahl , et al. September 20, 2 | 2016-09-20 |
Method and structure to reduce the electric field in semiconductor wiring interconnects
Grant 9,379,057 - Huang , et al. June 28, 2 | 2016-06-28 |
Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect
Grant 9,349,687 - Gates , et al. May 24, 2 | 2016-05-24 |
Air Gap Structure With Bilayer Selective Cap
App 20160133575 - Gates; Stephen M. ; et al. | 2016-05-12 |
Air Gap Structure With Bilayer Selective Cap
App 20160133508 - Gates; Stephen M. ; et al. | 2016-05-12 |
Air gap semiconductor structure with selective cap bilayer
Grant 9,305,836 - Gates , et al. April 5, 2 | 2016-04-05 |
Method And Structure To Reduce The Electric Field In Semiconductor Wiring Interconnects
App 20160064330 - Huang; Elbert Emin ; et al. | 2016-03-03 |
Method And Structure To Reduce The Electric Field In Semiconductor Wiring Interconnects
App 20160064321 - Huang; Elbert Emin ; et al. | 2016-03-03 |
Profile control in interconnect structures
Grant 9,105,641 - Chen , et al. August 11, 2 | 2015-08-11 |
Profile Control In Interconnect Structures
App 20150035154 - Chen; Shyng-Tsong ; et al. | 2015-02-05 |
Method of fabricating a profile control in interconnect structures
Grant 8,835,305 - Yang , et al. September 16, 2 | 2014-09-16 |
Profile Control In Interconnect Structures
App 20140035142 - Yang; Chih-Chao ; et al. | 2014-02-06 |
Method for integrating liner formation in back end of line processing
Grant 7,544,609 - Angyal , et al. June 9, 2 | 2009-06-09 |
Method for Integrating Liner Formation in Back End of Line Processing
App 20080194099 - Angyal; Matthew S. ; et al. | 2008-08-14 |
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