Peng; Sheng-Yang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peng; Sheng-Yang.The latest application filed is for "heading calibration method and compass sensor using the same".

Company Profile

1.10.15

Peng; Sheng-Yang - New Taipei TW
Peng; Sheng-Yang - Hsinchu N/A TW
Peng; Sheng-Yang - Hsinchu City TW
Peng; Sheng-Yang - Kaohsiung City TW
Peng; Sheng-Yang - Kaohsiung N/A TW
Peng; Sheng-Yang - Kao-Hsiung TW
Peng; Sheng-Yang - Kao-Hsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Display screen or portion thereof with animated graphical user interface Grant D922,402 - Chiu , et al. June 15, 2	2021-06-15
Display screen or portion thereof with graphical user interface Grant D919,635 - Chiu , et al. May 18, 2	2021-05-18
Heading calibration method and compass sensor using the same Grant 9,726,488 - Peng , et al. August 8, 2	2017-08-08
Heading Calibration Method And Compass Sensor Using The Same App 20150032399 - Peng; Sheng-Yang ; et al.	2015-01-29
Electronic Device App 20150025657 - Peng; Sheng-Yang ; et al.	2015-01-22
Chip Structure And Wafer Structure App 20130292803 - Peng; Sheng-Yang	2013-11-07
Process of fabricating chip Grant 8,501,579 - Peng August 6, 2	2013-08-06
Light Emitting Diode Packages And Methods Of Making App 20130161670 - Peng; Sheng-Yang	2013-06-27
Chip Structure, Wafer Structure And Process Of Faabricating Chip App 20100230788 - PENG; SHENG-YANG	2010-09-16
Wafer sawing method Grant 7,611,967 - Peng November 3, 2	2009-11-03
Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same Grant 7,573,124 - Wang , et al. August 11, 2	2009-08-11
Semiconductor Package Structure, Applications Thereof And Manufacturing Method Of The Same App 20090140413 - WANG; Meng-Jen ; et al.	2009-06-04
Wafer Sawing Method App 20080261351 - Peng; Sheng-Yang	2008-10-23
Chip Hermetic Package Device And Method For Producing The Same App 20080230885 - Wang; Meng-jen ; et al.	2008-09-25
Semiconductor Packaging Structure Having Electromagnetic Shielding Function And Method For Manufacturing The Same App 20080087987 - Wang; Meng-Jen ; et al.	2008-04-17
Semiconductor Device Package App 20070252261 - Wang; Meng-Jen ; et al.	2007-11-01
Package structure compatible with cooling system Grant 7,071,553 - Tsai , et al. July 4, 2	2006-07-04
Package Structure Compatible With Cooling System App 20050006756 - Tsai, Tsung-Yueh ; et al.	2005-01-13
Package structure compatible with cooling system Grant 6,801,429 - Tsai , et al. October 5, 2	2004-10-05
[package Structure Compatible With Cooling System] App 20040165351 - TSAI, TSUNG-YUEH ; et al.	2004-08-26

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