Peng; Peng-Yih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peng; Peng-Yih.The latest application filed is for "wafer polishing head".

Company Profile

0.4.5

Peng; Peng-Yih - Hsinchu Hsien TW
Peng; Peng-Yih - Hsin-Chu Hsien TW
Peng; Peng-Yih - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Polishing Head App 20070298694 - Lin; Chin-Kun ; et al.	2007-12-27
Wafer Stage Having An Encapsulated Central Pedestal Plate App 20070181420 - Wang; Ming-Tung ; et al.	2007-08-09
Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization App 20070066187 - Yang; Chih-Chiang ; et al.	2007-03-22
Auxiliary gasline-heating unit in chemical vapor deposition App 20010042930 - Lin, Juen-Kuen ; et al.	2001-11-22
Chemical-mechanical polish machines and fabrication process using the same Grant 6,293,850 - Lin , et al. September 25, 2	2001-09-25
Wafer polishing head App 20010000770 - Lin, Juen-Kuen ; et al.	2001-05-03
Chemical-mechanical polish machines and fabrication process using the same Grant 6,183,350 - Lin , et al. February 6, 2	2001-02-06
Cleaning system with automatically controlled brush pressure Grant 6,119,294 - Lai , et al. September 19, 2	2000-09-19
Chemical-mechanical polishing pad Grant 6,120,366 - Lin , et al. September 19, 2	2000-09-19

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