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Adaptive optimization of low power strategies
Grant 10,345,887 - Hsiao , et al. July 9, 2 | 2019-07-09 |
Controlling method for optimizing a processor and controlling system
Grant 10,216,526 - Peng , et al. Feb | 2019-02-26 |
Thermal control system and thermal control method for electronic device
Grant 10,114,432 - Peng , et al. October 30, 2 | 2018-10-30 |
Bandgap reference apparatus and methods
Grant 9,958,895 - Chen , et al. May 1, 2 | 2018-05-01 |
Method For Controlling A Plurality Of Hardware Modules And Associated Controller And System
App 20180039324 - Lee; Yen-Lin ; et al. | 2018-02-08 |
Adaptive Optimization of Low Power Strategies
App 20170322616 - Hsiao; Kuo-Su ; et al. | 2017-11-09 |
Networking packages based on interposers
Grant 9,686,865 - Lee , et al. June 20, 2 | 2017-06-20 |
Integrated circuit system with distributed power supply comprising interposer and voltage regulator
Grant 9,406,597 - Chi , et al. August 2, 2 | 2016-08-02 |
Controlling Method For Optimizing A Processor And Controlling System
App 20160203006 - PENG; Mark Shane ; et al. | 2016-07-14 |
Thermal Control System And Thermal Control Method For Electronic Device
App 20160187897 - Peng; Mark Shane ; et al. | 2016-06-30 |
Apparatus and method for increasing bandwidths of stacked dies
Grant 9,177,892 - Chi , et al. November 3, 2 | 2015-11-03 |
Networking Packages Based on Interposers
App 20150289376 - Lee; Yun-Han ; et al. | 2015-10-08 |
Networking packages based on interposers
Grant 9,064,715 - Lee , et al. June 23, 2 | 2015-06-23 |
Apparatus and Method for Increasing Bandwidths of Stacked Dies
App 20150145147 - Chi; Shyh-An ; et al. | 2015-05-28 |
Apparatus and method for increasing bandwidths of stacked dies
Grant 8,952,548 - Chi , et al. February 10, 2 | 2015-02-10 |
Programmable semiconductor interposer for electronic package and method of forming
Grant 8,945,998 - Hsu , et al. February 3, 2 | 2015-02-03 |
Integrated Circuit System With Distributed Power Supply
App 20140210077 - CHI; Shyh-An ; et al. | 2014-07-31 |
Integrated circuit system with distributed power supply comprising interposer and voltage regulator module
Grant 8,716,855 - Chi , et al. May 6, 2 | 2014-05-06 |
Programmable Semiconductor Interposer for Electronic Package and Method of Forming
App 20130295727 - Hsu; Chao-Shun ; et al. | 2013-11-07 |
Programmable semiconductor interposer for electronic package and method of forming
Grant 8,476,735 - Hsu , et al. July 2, 2 | 2013-07-02 |
Event-based Bio-signal Capturing System
App 20130150698 - Hsu; Fu-Chieh ; et al. | 2013-06-13 |
Class-d Amplifier
App 20130147552 - Hsu; Fu-Chieh ; et al. | 2013-06-13 |
Apparatus and Method for Increasing Bandwidths of Stacked Dies
App 20120250286 - Chi; Shyh-An ; et al. | 2012-10-04 |
Reducing voltage drops in power networks using unused spaces in integrated circuits
Grant 8,276,110 - Baviskar , et al. September 25, 2 | 2012-09-25 |
Bandgap Reference Apparatus and Methods
App 20120176186 - Chen; Chih-Chia ; et al. | 2012-07-12 |
Networking Packages Based on Interposers
App 20120147567 - Lee; Yun-Han ; et al. | 2012-06-14 |
Integrated Circuit System With Distributed Power Supply
App 20120112352 - CHI; Shyh-An ; et al. | 2012-05-10 |
Clocking architecture in stacked and bonded dice
Grant 7,989,226 - Peng August 2, 2 | 2011-08-02 |
Reducing Voltage Drops in Power Networks Using Unused Spaces in Integrated Circuits
App 20110185331 - Baviskar; Dinesh ; et al. | 2011-07-28 |
Clocking Architecture in Stacked and Bonded Dice
App 20110102044 - Peng; Mark Shane | 2011-05-05 |
Clocking architecture in stacked and bonded dice
Grant 7,859,117 - Peng December 28, 2 | 2010-12-28 |
TSV-enabled twisted pair
Grant 7,812,426 - Peng , et al. October 12, 2 | 2010-10-12 |
Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom
Grant 7,795,735 - Hsu , et al. September 14, 2 | 2010-09-14 |
TSV-Enabled Twisted Pair
App 20090294915 - Peng; Mark Shane ; et al. | 2009-12-03 |
SiP (system in package) design systems and methods
Grant 7,565,635 - Chao , et al. July 21, 2 | 2009-07-21 |
Stacked structures and methods of fabricating stacked structures
Grant 7,514,775 - Chao , et al. April 7, 2 | 2009-04-07 |
Design techniques for stacking identical memory dies
Grant 7,494,846 - Hsu , et al. February 24, 2 | 2009-02-24 |
Programmable semiconductor interposer for electronic package and method of forming
App 20080296697 - Hsu; Chao-Shun ; et al. | 2008-12-04 |
Sip (system In Package) Design Systems And Methods
App 20080250182 - Chao; Clinton ; et al. | 2008-10-09 |
Methods For Forming Single Dies With Multi-layer Interconnect Structures And Structures Formed Therefrom
App 20080233710 - Hsu; Chao-Shun ; et al. | 2008-09-25 |
Electromagnetic shielding using through-silicon vias
Grant 7,427,803 - Chao , et al. September 23, 2 | 2008-09-23 |
Design techniques for stacking identical memory dies
App 20080220565 - Hsu; Chao-Shun ; et al. | 2008-09-11 |
Clocking architecture in stacked and bonded dice
App 20080204104 - Peng; Mark Shane | 2008-08-28 |
Stacked Structures And Methods Of Fabricating Stacked Structures
App 20080083975 - Chao; Clinton ; et al. | 2008-04-10 |
Electromagnetic shielding using through-silicon vias
App 20080073747 - Chao; Clinton ; et al. | 2008-03-27 |
Test probe for integrated circuits with ultra-fine pitch terminals
App 20080018350 - Chao; Clinton ; et al. | 2008-01-24 |
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