PENG; Kuo-Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for PENG; Kuo-Feng.The latest application filed is for "led package module".

Company Profile

0.2.17

PENG; Kuo-Feng - Zhubei City TW
Peng; Kuo-Feng - Shinchu Hsien TW
Peng; Kuo-Feng - Chu-Dong Town TW
Peng; Kuo Feng - Hsinchu Hsien TW
Peng; Kuo Feng - Chupei Hsinchu Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Led Package Module App 20130113369 - PENG; Kuo-Feng	2013-05-09
Led Package Module App 20130113001 - PENG; Kuo-Feng	2013-05-09
Processes for packing memory cards by single mold App 20060090334 - Chen; Chi Hong ; et al.	2006-05-04
Housing for memory card App 20060082986 - Chen; Chi Hong ; et al.	2006-04-20
MMC memory card with TSOP package App 20060083044 - Chen; Chi Hong ; et al.	2006-04-20
Window type case for memory card App 20050093119 - Chen, Wen Chuan ; et al.	2005-05-05
Package structure of an image sensor and packaging Grant 6,646,316 - Wu , et al. November 11, 2	2003-11-11
Structure of stacked integrated circuits Grant 6,441,496 - Chen , et al. August 27, 2	2002-08-27
Structure Of Stacked Integrated Circuits And Method For Manufacturing The Same App 20020096780 - Chen, Wen Chuan ; et al.	2002-07-25
Substrate Structure For An Integrated Circuit Package And Method For Manufacturing The Same App 20020096360 - Ho, Mon Nan ; et al.	2002-07-25
Integrated circuit structure having an adhesive agent and method for manufacturing the same App 20020096751 - Chen, Wen Chuan ; et al.	2002-07-25
Structure of stacked integrated circuits and method for manufacturing the same App 20020096762 - Chen, Wen Chuan ; et al.	2002-07-25
Package structure of integrated circuits and method for packaging the same App 20020096766 - Chen, Wen Chuan ; et al.	2002-07-25
Structure Of Stacked Integrated Circuits And Method For Manufacturing The Same App 20020096761 - Chen, Wen Chuan ; et al.	2002-07-25
Stacked structure of integrated circuits App 20020096754 - Chen, Wen Chuan ; et al.	2002-07-25
Package structure of an image sensor and method for packaging the same App 20020096731 - Wu, Jichen ; et al.	2002-07-25
Package structure of an image sensor and method for packaging the same App 20020096782 - Wu, Jichen ; et al.	2002-07-25
Structure of a photosensor and method for packaging the same App 20020060287 - Ho, Mon Nan ; et al.	2002-05-23
Stackable integrated circuit App 20020043709 - Yeh, Nai Hua ; et al.	2002-04-18

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