Peng; Jung-Huei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Peng; Jung-Huei.The latest application filed is for "method for manufacturing a mems device by first hybrid bonding a cmos wafer to a mems wafer".
Company Profile
26.108.95
- Peng; Jung-Huei - Jhubei City TW
- Peng; Jung-Huei - Jhubei TW
- Peng; Jung-Huei - Hsinchu Hsien TW
- PENG; Jung-Huei - Hsinchu TW
- Peng; Jung-Huei - Hsien TW
- Peng; Jung-Huei - Hsinchu County TW
Patent Activity
| Patent | Date |
|---|---|
| Method For Manufacturing A Mems Device By First Hybrid Bonding A Cmos Wafer To A Mems Wafer App 20220204340 - Lin; Hung-Hua ; et al. | 2022-06-30 |
| Method To Produce Chemical Pattern In Micro-fluidic Structure App 20220184614 - TSAI; Shang-Ying ; et al. | 2022-06-16 |
| Semiconductor structure for MEMS device Grant 11,312,623 - Liu , et al. April 26, 2 | 2022-04-26 |
| Method to produce chemical pattern in micro-fluidic structure Grant 11,298,697 - Tsai , et al. April 12, 2 | 2022-04-12 |
| Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer Grant 11,279,615 - Lin , et al. March 22, 2 | 2022-03-22 |
| CMOS-MEMS structure and method of forming the same Grant 11,148,936 - Peng , et al. October 19, 2 | 2021-10-19 |
| MEMS devices with an element having varying widths Grant 11,130,670 - Tsai , et al. September 28, 2 | 2021-09-28 |
| MEMS devices including MEMS dies and connectors thereto Grant 11,117,796 - Cheng , et al. September 14, 2 | 2021-09-14 |
| MEMS devices and methods of fabrication thereof Grant 11,104,129 - Peng , et al. August 31, 2 | 2021-08-31 |
| Fluid deposition apparatus and method Grant 11,027,310 - Cheng , et al. June 8, 2 | 2021-06-08 |
| Mems Structure And Manufacturing Method Thereof App 20210087056 - HUANG; KANG-CHE ; et al. | 2021-03-25 |
| Semiconductor Mems Structure App 20210053816 - HSIEH; Yuan-Chih ; et al. | 2021-02-25 |
| Structure and Method for Integrated Microphone App 20200413210 - Peng; Jung-Huei ; et al. | 2020-12-31 |
| Semiconductor Structure For Mems Device App 20200361767 - Liu; Yu-Chia ; et al. | 2020-11-19 |
| Mems Devices Including Mems Dies And Connectors Thereto App 20200339412 - Cheng; Chun-Wen ; et al. | 2020-10-29 |
| Semiconductor MEMS structure Grant 10,787,360 - Hsieh , et al. September 29, 2 | 2020-09-29 |
| Method for manufacturing a microphone Grant 10,779,100 - Peng , et al. Sept | 2020-09-15 |
| Semiconductor structure for MEMS device Grant 10,752,497 - Liu , et al. A | 2020-08-25 |
| MEMS devices including MEMS dies and connectors thereto Grant 10,710,871 - Cheng , et al. | 2020-07-14 |
| MEMS devices and methods of fabrication thereof Grant 10,688,786 - Peng , et al. | 2020-06-23 |
| Cmos-mems Structure And Method Of Forming The Same App 20200140266 - PENG; JUNG-HUEI ; et al. | 2020-05-07 |
| Method to Produce Chemical Pattern In Micro-Fluidic Structure App 20200070153 - Tsai; Shang-Ying ; et al. | 2020-03-05 |
| MEMS Devices Including MEMS Dies and Connectors Thereto App 20200024129 - Cheng; Chun-Wen ; et al. | 2020-01-23 |
| MEMS Devices and Methods of Fabrication Thereof App 20200023642 - Peng; Jung-Huei ; et al. | 2020-01-23 |
| MEMS devices including MEMS dies and connectors thereto Grant 10,508,023 - Cheng , et al. Dec | 2019-12-17 |
| CMOS-MEMS structure and method of forming the same Grant 10,508,027 - Peng , et al. Dec | 2019-12-17 |
| Method to produce chemical pattern in micro-fluidic structure Grant 10,486,153 - Tsai , et al. Nov | 2019-11-26 |
| Semiconductor Mems Structure App 20190256346 - HSIEH; Yuan-Chih ; et al. | 2019-08-22 |
| MEMS Devices and Methods of Forming the Same App 20190248646 - Tsai; Shang-Ying ; et al. | 2019-08-15 |
| Method For Manufacturing A Mems Device By First Hybrid Bonding A Cmos Wafer To A Mems Wafer App 20190241430 - Lin; Hung-Hua ; et al. | 2019-08-08 |
| MEMS device with viewer window and manufacturing method thereof Grant 10,351,417 - Cheng , et al. July 16, 2 | 2019-07-16 |
| Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer Grant 10,294,098 - Lin , et al. | 2019-05-21 |
| Micro-electro-mechanical system and manufacturing method thereof Grant 10,273,148 - Cheng , et al. | 2019-04-30 |
| Semiconductor MEMS structure Grant 10,273,142 - Hsieh , et al. | 2019-04-30 |
| Multi-pressure MEMS package Grant 10,273,144 - Liu , et al. | 2019-04-30 |
| Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring Grant 10,266,390 - Tsai , et al. | 2019-04-23 |
| MEMS device with enhanced sensing structure and manufacturing method thereof Grant 10,266,396 - Shen , et al. | 2019-04-23 |
| Semiconductor Structure For Mems Device App 20190112183 - Liu; Yu-Chia ; et al. | 2019-04-18 |
| a method for manufacturing a mems device by first hybrid bonding a cmos wafer to a mems wafer App 20190092627 - Lin; Hung-Hua ; et al. | 2019-03-28 |
| Mems Device With Viewer Window And Manufacturing Method Thereof App 20190062151 - CHENG; CHUN-WEN ; et al. | 2019-02-28 |
| Semiconductor structure with cavity spacing monitoring functions Grant 10,202,278 - Peng , et al. Feb | 2019-02-12 |
| Semiconductor structure for MEMS Device Grant 10,160,639 - Liu , et al. Dec | 2018-12-25 |
| Cmos-mems Structure And Method Of Forming The Same App 20180362335 - PENG; JUNG-HUEI ; et al. | 2018-12-20 |
| Fluid deposition appartus and method Grant 10,155,244 - Cheng , et al. Dec | 2018-12-18 |
| Mems Device With Enhanced Sensing Structure And Manufacturing Method Thereof App 20180339899 - SHEN; CHING-KAI ; et al. | 2018-11-29 |
| MEMS Devices and Methods of Fabrication Thereof App 20180311955 - Peng; Jung-Huei ; et al. | 2018-11-01 |
| Structure and Method for Integrated Microphone App 20180288549 - Peng; Jung-Huei ; et al. | 2018-10-04 |
| CMOS-MEMS structure and method of forming the same Grant 10,046,965 - Peng , et al. August 14, 2 | 2018-08-14 |
| MEMS Devices Including MEMS Dies and Connectors Thereto App 20180194613 - Cheng; Chun-Wen ; et al. | 2018-07-12 |
| Method for manufacturing a microphone Grant 9,998,843 - Peng , et al. June 12, 2 | 2018-06-12 |
| MEMS devices and methods of fabrication thereof Grant 9,950,522 - Peng , et al. April 24, 2 | 2018-04-24 |
| Semiconductor Mems Structure App 20180099865 - HSIEH; Yuan-Chih ; et al. | 2018-04-12 |
| Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device Grant 9,938,134 - Lin , et al. April 10, 2 | 2018-04-10 |
| MEMS devices including MEMS dies and connectors thereto Grant 9,919,914 - Cheng , et al. March 20, 2 | 2018-03-20 |
| Semiconductor Structure With Cavity Spacing Monitoring Functions App 20180065841 - PENG; JUNG-HUEI ; et al. | 2018-03-08 |
| Semiconductor Structure For Mems Device App 20170369308 - Liu; Yu-Chia ; et al. | 2017-12-28 |
| Cap and substrate electrical connection at wafer level Grant 9,834,436 - Peng December 5, 2 | 2017-12-05 |
| Structure and formation method of semiconductor device structure Grant 9,834,435 - Liu , et al. December 5, 2 | 2017-12-05 |
| Semiconductor MEMS structure and manufacturing method thereof Grant 9,828,234 - Hsieh , et al. November 28, 2 | 2017-11-28 |
| MEMS and CMOS integration with low-temperature bonding Grant 9,822,000 - Cheng , et al. November 21, 2 | 2017-11-21 |
| Method to Produce Chemical Pattern In Micro-Fluidic Structure App 20170326548 - Tsai; Shang-Ying ; et al. | 2017-11-16 |
| Semiconductor Mems Structure And Manufacturing Method Thereof App 20170313574 - HSIEH; YUAN-CHIH ; et al. | 2017-11-02 |
| Getter Electrode To Improve Vacuum Level In A Microelectromechanical Systems (mems) Device App 20170297904 - Lin; Shiang-Chi ; et al. | 2017-10-19 |
| Multi-pressure Mems Package App 20170283250 - Liu; Yu-Chia ; et al. | 2017-10-05 |
| Multi-pressure MEMS package Grant 9,695,039 - Liu , et al. July 4, 2 | 2017-07-04 |
| Cmos-mems Structure And Method Of Forming The Same App 20170183222 - PENG; JUNG-HUEI ; et al. | 2017-06-29 |
| Methods of forming a gyroscope sensor and a structure for a gyroscope sensors Grant 9,677,884 - Wu , et al. June 13, 2 | 2017-06-13 |
| Method and apparatus for a wafer seal ring Grant 9,673,169 - Teng , et al. June 6, 2 | 2017-06-06 |
| Method to produce chemical pattern in micro-fluidic structure Grant 9,656,260 - Tsai , et al. May 23, 2 | 2017-05-23 |
| Semiconductor device and package and manufacturing method thereof Grant 9,643,838 - Chu , et al. May 9, 2 | 2017-05-09 |
| Semiconductor sensing structure Grant 9,630,831 - Peng , et al. April 25, 2 | 2017-04-25 |
| Semiconductor Sensing Structure App 20170107099 - PENG; JUNG-HUEI ; et al. | 2017-04-20 |
| Semiconductor device Grant 9,617,143 - Cheng , et al. April 11, 2 | 2017-04-11 |
| Self-removal anti-stiction coating for bonding process Grant 9,611,141 - Liu , et al. April 4, 2 | 2017-04-04 |
| Fluid Deposition Apparatus and Method App 20170065958 - Cheng; Chun-Wen ; et al. | 2017-03-09 |
| Mems And Cmos Integration With Low-temperature Bonding App 20170057814 - Cheng; Chun-Wen ; et al. | 2017-03-02 |
| Micro-electro-mechanical System And Manufacturing Method Thereof App 20170044004 - CHENG; CHUN-WEN ; et al. | 2017-02-16 |
| Method of removing waste of substrate and waste removing device thereof Grant 9,545,691 - Cho , et al. January 17, 2 | 2017-01-17 |
| MEMS structures and methods for forming the same Grant 9,533,876 - Liu , et al. January 3, 2 | 2017-01-03 |
| MEMS Devices and Methods for Forming Same App 20160368762 - Cheng; Chun-Wen ; et al. | 2016-12-22 |
| Semiconductor device with through molding vias and method of making the same Grant 9,469,524 - Cheng , et al. October 18, 2 | 2016-10-18 |
| Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone Grant 9,462,402 - Cho , et al. October 4, 2 | 2016-10-04 |
| Method to Produce Chemical Pattern in Micro-Fluidic Structure App 20160271607 - Tsai; Shang-Ying ; et al. | 2016-09-22 |
| Monolithic Complementary Metal-oxide Semiconductor (cmos) - Integrated Silicon Microphone App 20160241979 - Cho; Chin-Yi ; et al. | 2016-08-18 |
| Self-removal Anti-stiction Coating For Bonding Process App 20160229693 - Liu; Ping-Yin ; et al. | 2016-08-11 |
| MEMS and CMOS integration with low-temperature bonding Grant 9,394,161 - Cheng , et al. July 19, 2 | 2016-07-19 |
| Structure and Method for Integrated Microphone App 20160157038 - Peng; Jung-Huei ; et al. | 2016-06-02 |
| Package systems Grant 9,355,896 - Shu , et al. May 31, 2 | 2016-05-31 |
| MEMS devices and methods for forming same Grant 9,352,956 - Cheng , et al. May 31, 2 | 2016-05-31 |
| Method to produce chemical pattern in micro-fluidic structure Grant 9,352,315 - Tsai , et al. May 31, 2 | 2016-05-31 |
| Mems And Cmos Integration With Low-temperature Bonding App 20160137492 - Cheng; Chun-Wen ; et al. | 2016-05-19 |
| Cap and Substrate Electrical Connection at Wafer Level App 20160096722 - Peng; Jung-Huei | 2016-04-07 |
| Wafer level packaging bond Grant 9,293,445 - Liu , et al. March 22, 2 | 2016-03-22 |
| Wafer level packaging techniques Grant 9,269,679 - Teng , et al. February 23, 2 | 2016-02-23 |
| MEMS Devices and Methods of Forming the Same App 20160046482 - Lin; Hung-Hua ; et al. | 2016-02-18 |
| Structure and method for integrated microphone Grant 9,264,833 - Peng , et al. February 16, 2 | 2016-02-16 |
| Triple-axis MEMS accelerometer Grant 9,238,581 - Wu , et al. January 19, 2 | 2016-01-19 |
| MEMS Devices and Methods of Fabrication Thereof App 20160009089 - Peng; Jung-Huei ; et al. | 2016-01-14 |
| MEMS device and method of forming the same Grant 9,233,839 - Liu , et al. January 12, 2 | 2016-01-12 |
| Semiconductor Device With Through Molding Vias And Method Of Making The Same App 20160002027 - CHENG; Chun-wen ; et al. | 2016-01-07 |
| Cap and substrate electrical connection at wafer level Grant 9,212,050 - Peng December 15, 2 | 2015-12-15 |
| Package Systems App 20150340341 - SHU; Chia-Pao ; et al. | 2015-11-26 |
| MEMS devices and methods of forming the same Grant 9,181,083 - Tsai , et al. November 10, 2 | 2015-11-10 |
| Semiconductor device with through molding vias Grant 9,150,404 - Cheng , et al. October 6, 2 | 2015-10-06 |
| MEMS Structures and Methods for Forming the Same App 20150266722 - Liu; Ping-Yin ; et al. | 2015-09-24 |
| MEMS devices and methods of fabrication thereof Grant 9,138,994 - Peng , et al. September 22, 2 | 2015-09-22 |
| Method of making flowcell with micro-fluid structure Grant 9,114,396 - Tsai , et al. August 25, 2 | 2015-08-25 |
| Package systems and manufacturing methods thereof Grant 9,112,001 - Shu , et al. August 18, 2 | 2015-08-18 |
| Mems Devices And Methods For Forming Same App 20150197419 - Cheng; Chun-Wen ; et al. | 2015-07-16 |
| Method Of Making Flowcell With Micro-fluid Structure App 20150196912 - TSAI; Shang-Ying ; et al. | 2015-07-16 |
| Method Of Removing Waste Of Substrate And Waste Removing Device Thereof App 20150174700 - CHO; CHIN-YI ; et al. | 2015-06-25 |
| Semiconductor Device With Through Molding Vias App 20150166329 - CHENG; Chun-wen ; et al. | 2015-06-18 |
| Semiconductor Device App 20150166331 - CHENG; Chun-wen ; et al. | 2015-06-18 |
| MEMS structures and methods for forming the same Grant 9,054,121 - Liu , et al. June 9, 2 | 2015-06-09 |
| MEMS device and method of formation thereof Grant 9,034,677 - Huang , et al. May 19, 2 | 2015-05-19 |
| Wafer Level Packaging Techniques App 20150123129 - Teng; Yi-Chuan ; et al. | 2015-05-07 |
| Method To Produce Chemical Pattern In Micro-fluidic Structure App 20150093303 - Tsai; Shang-Ying ; et al. | 2015-04-02 |
| Fluid Deposition Appartus And Method App 20150079704 - Cheng; Chun-Wen ; et al. | 2015-03-19 |
| Mems Device And Method Of Forming The Same App 20150035089 - LIU; YU-CHIA ; et al. | 2015-02-05 |
| MEMS Devices and Methods of Forming the Same App 20150031159 - Tsai; Shang-Ying ; et al. | 2015-01-29 |
| Semiconductor device Grant 8,941,152 - Cheng , et al. January 27, 2 | 2015-01-27 |
| Self-removal anti-stiction coating for bonding process Grant 8,905,293 - Liu , et al. December 9, 2 | 2014-12-09 |
| MEMS device and method of forming the same Grant 8,900,905 - Liu , et al. December 2, 2 | 2014-12-02 |
| MEMS devices and methods of forming the same Grant 8,853,801 - Tsai , et al. October 7, 2 | 2014-10-07 |
| Gyroscope Sensors App 20140283369 - WU; Ting-Hau ; et al. | 2014-09-25 |
| Systems and methods for post-bonding wafer edge seal Grant 8,841,201 - Teng , et al. September 23, 2 | 2014-09-23 |
| Structure and Method for Integrated Microphone App 20140270272 - Peng; Jung-Huei ; et al. | 2014-09-18 |
| MEMS Device and Method of Formation Thereof App 20140248730 - Huang; Hsin-Ting ; et al. | 2014-09-04 |
| Systems And Methods For Post-bonding Wafer Edge Seal App 20140231967 - Teng; Yi-Chuan ; et al. | 2014-08-21 |
| Method and Apparatus for a Wafer Seal Ring App 20140220735 - Teng; Yi-Chuan ; et al. | 2014-08-07 |
| Gyroscope sensors Grant 8,776,600 - Wu , et al. July 15, 2 | 2014-07-15 |
| Package Systems And Manufacturing Methods Thereof App 20140170849 - SHU; Chia-Pao ; et al. | 2014-06-19 |
| Method to prevent metal pad damage in wafer level package Grant 8,735,260 - Tsai , et al. May 27, 2 | 2014-05-27 |
| Wafer Level Packaging Bond App 20140138853 - Liu; Martin ; et al. | 2014-05-22 |
| Method and apparatus for selectively removing anti-stiction coating Grant 8,728,845 - Lin , et al. May 20, 2 | 2014-05-20 |
| Bonding layer structure and method for wafer to wafer bonding Grant 8,686,571 - Huang , et al. April 1, 2 | 2014-04-01 |
| Package systems having a eutectic bonding material and manufacturing methods thereof Grant 8,674,495 - Shu , et al. March 18, 2 | 2014-03-18 |
| Cap and Substrate Electrical Connection at Wafer Level App 20140061730 - Peng; Jung-Huei | 2014-03-06 |
| Bonding Layer Structure And Method For Wafer To Wafer Bonding App 20140042625 - Huang; Hsin-Ting ; et al. | 2014-02-13 |
| Wafer level packaging bond Grant 8,647,962 - Liu , et al. February 11, 2 | 2014-02-11 |
| Triple-Axis MEMS Accelerometer App 20140024160 - Wu; Ting-Hau ; et al. | 2014-01-23 |
| Cap and substrate electrical connection at wafer level Grant 8,609,466 - Peng December 17, 2 | 2013-12-17 |
| Method of fabricating a semiconductor device having recessed bonding site Grant 8,580,594 - Huang , et al. November 12, 2 | 2013-11-12 |
| MEMS Devices and Methods of Forming the Same App 20130277770 - Tsai; Shang-Ying ; et al. | 2013-10-24 |
| Laser bonding for stacking semiconductor substrates Grant 8,563,400 - Wu , et al. October 22, 2 | 2013-10-22 |
| Laser Bonding for Stacking Semiconductor Substrates App 20130140285 - Wu; Ting-Hau ; et al. | 2013-06-06 |
| Method for reducing chip warpage Grant 8,455,999 - Wu , et al. June 4, 2 | 2013-06-04 |
| MEMS Structures and Methods for Forming the Same App 20130099355 - Liu; Ping-Yin ; et al. | 2013-04-25 |
| Method and structure for wafer to wafer bonding in semiconductor packaging Grant 8,377,798 - Peng , et al. February 19, 2 | 2013-02-19 |
| Mems Device And Method Of Formation Thereof App 20130037891 - Huang; Hsin-Ting ; et al. | 2013-02-14 |
| Laser bonding for stacking semiconductor substrates Grant 8,367,516 - Wu , et al. February 5, 2 | 2013-02-05 |
| Triple-axis MEMS accelerometer Grant 8,362,578 - Wu , et al. January 29, 2 | 2013-01-29 |
| Gyroscope Sensors App 20130000409 - WU; Ting-Hau ; et al. | 2013-01-03 |
| Method to produce 3-D optical gyroscope my MEMS technology Grant 8,281,658 - Wu , et al. October 9, 2 | 2012-10-09 |
| Method And Apparatus For Selectively Removing Anti-stiction Coating App 20120244677 - Lin; Shih-Wei ; et al. | 2012-09-27 |
| Method and apparatus for cooling an integrated circuit Grant 8,237,263 - Wu , et al. August 7, 2 | 2012-08-07 |
| Metal-ceramic multilayer structure Grant 8,237,235 - Wu , et al. August 7, 2 | 2012-08-07 |
| Package systems having a conductive element through a substrate thereof and manufacturing methods of the same Grant 8,232,614 - Chu , et al. July 31, 2 | 2012-07-31 |
| MEMS microphone with single polysilicon film Grant 8,218,286 - Wu , et al. July 10, 2 | 2012-07-10 |
| Self-removal Anti-stiction Coating For Bonding Process App 20120148870 - Liu; Ping-Yin ; et al. | 2012-06-14 |
| Method To Prevent Metal Pad Damage In Wafer Level Package App 20120149152 - Tsai; Shang-Ying ; et al. | 2012-06-14 |
| Method And Structure For Wafer To Wafer Bonding In Semiconductor Packaging App 20120115305 - PENG; Jung-Huei ; et al. | 2012-05-10 |
| Package Systems And Manufacturing Methods Thereof App 20120086127 - SHU; Chia-Pao ; et al. | 2012-04-12 |
| Triple-axis MEMS accelerometer having a bottom capacitor Grant 8,106,470 - Wu , et al. January 31, 2 | 2012-01-31 |
| Method for Reducing Chip Warpage App 20120007220 - Wu; Ting-Hau ; et al. | 2012-01-12 |
| Method for reducing chip warpage Grant 8,053,336 - Wu , et al. November 8, 2 | 2011-11-08 |
| Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same Grant 8,053,377 - Tsai , et al. November 8, 2 | 2011-11-08 |
| Wafer Level Packaging Bond App 20110233621 - Liu; Martin ; et al. | 2011-09-29 |
| Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures Grant 7,998,775 - Tsai , et al. August 16, 2 | 2011-08-16 |
| Method and Apparatus for Cooling an Integrated Circuit App 20110156245 - Wu; Ting-Hau ; et al. | 2011-06-30 |
| Multi-step process for forming high-aspect-ratio holes for MEMS devices Grant 7,923,379 - Lee , et al. April 12, 2 | 2011-04-12 |
| Low Stress Photo-Sensitive Resin with Sponge-Like Structure and Devices Manufactured Employing Same App 20110081740 - TSAI; SHANG-YING ; et al. | 2011-04-07 |
| Cap And Substrate Electrical Connection At Wafer Level App 20110014750 - Peng; Jung-Huei | 2011-01-20 |
| Triple-Axis MEMS Accelerometer Having a Bottom Capacitor App 20100308424 - Wu; Ting-Hau ; et al. | 2010-12-09 |
| Triple-Axis MEMS Accelerometer App 20100301433 - Wu; Ting-Hau ; et al. | 2010-12-02 |
| Metal-Ceramic Multilayer Structure App 20100258883 - Wu; Ting-Hau ; et al. | 2010-10-14 |
| MEMS Devices and Methods of Fabrication Thereof App 20100225708 - Peng; Jung-Huei ; et al. | 2010-09-09 |
| Silicon Undercut Prevention in Sacrificial Oxide Release Process and Resulting MEMS Structures App 20100203664 - Tsai; Shang-Ying ; et al. | 2010-08-12 |
| Laser Bonding for Stacking Semiconductor Substrates App 20100178732 - Wu; Ting-Hau ; et al. | 2010-07-15 |
| Method to produce 3-D optical gyroscope my MEMS technology App 20100175479 - Wu; Ting-Hau ; et al. | 2010-07-15 |
| MEMS Microphone with Single Polysilicon Film App 20100117168 - Wu; Ting-Hau ; et al. | 2010-05-13 |
| Multi-Step Process for Forming High-Aspect-Ratio Holes for MEMS Devices App 20100120260 - Lee; Jiou-Kang ; et al. | 2010-05-13 |
| Method for Reducing Chip Warpage App 20100120202 - Wu; Ting-Hau ; et al. | 2010-05-13 |
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