Peng; Jie-Bo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Peng; Jie-Bo.The latest application filed is for "heat dissipation device".
- Peng; Jie-Bo - Shenzhen CN
| Patent | Date |
|---|---|
| Heat dissipation device Grant 7,779,894 - Peng , et al. August 24, 2 | 2010-08-24 |
| Heat Dissipation Device App 20080023176 - Peng; Jie-Bo ; et al. | 2008-01-31 |
| Thermal Module App 20070251675 - HWANG; CHING-BAI ; et al. | 2007-11-01 |
| Fastening Device For Mounting A Thermal Module To An Electronic Component App 20070253769 - HWANG; CHING-BAI ; et al. | 2007-11-01 |
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