Peng; I-Hsuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peng; I-Hsuan.The latest application filed is for "semiconductor package having a stiffener ring".

Company Profile

25.37.65

Peng; I-Hsuan - Hsinchu City TW
Peng; I-Hsuan - Hsinchu TW
Peng; I-Hsuan - Hsin-Chu TW
- Hsinchu TW
Peng; I-Hsuan - Jhudong Township TW
Peng; I-Hsuan - Taoyuan County TW
Peng; I Hsuan - Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Having A Stiffener Ring App 20220262691 - Pan; Chi-Wen ; et al.	2022-08-18
Semiconductor package structure Grant 11,410,936 - Lin , et al. August 9, 2	2022-08-09
Semiconductor Package Structure App 20220139848 - CHANG; Chia-Cheng ; et al.	2022-05-05
Semiconductor package having a stiffener ring Grant 11,302,592 - Pan , et al. April 12, 2	2022-04-12
Electronic Package With Rotated Semiconductor Die App 20220108954 - Su; Yao-Chun ; et al.	2022-04-07
Semiconductor package structure Grant 11,264,337 - Chang , et al. March 1, 2	2022-03-01
Semiconductor Package Structure Having An Annular Frame With Truncated Corners App 20220020726 - CHANG; Chia-Cheng ; et al.	2022-01-20
Electronic package with rotated semiconductor die Grant 11,222,850 - Su , et al. January 11, 2	2022-01-11
Semiconductor package structure having an annular frame with truncated corners Grant 11,171,113 - Chang , et al. November 9, 2	2021-11-09
Semiconductor Package Structure App 20210313299 - TSAI; Yi-Lin ; et al.	2021-10-07
Semiconductor Package Structure App 20210313271 - Tsai; Yi-Lin ; et al.	2021-10-07
Semiconductor Package Including Lid Structure With Opening And Recess App 20210175137 - CHANG; Chia-Cheng ; et al.	2021-06-10
Semiconductor Package Structure App 20210159177 - TSAI; Yi-Lin ; et al.	2021-05-27
Semiconductor Chip Package And Fabrication Method Thereof App 20210111090 - Tsai; Yi-Lin ; et al.	2021-04-15
Semiconductor package including lid structure with opening and recess Grant 10,957,611 - Chang , et al. March 23, 2	2021-03-23
Semiconductor package assembly and method for forming the same Grant 10,903,198 - Chang , et al. January 26, 2	2021-01-26
Electronic Package With Rotated Semiconductor Die App 20200365515 - Su; Yao-Chun ; et al.	2020-11-19
Semiconductor Package With Dummy Mim Capacitor Die App 20200365572 - Su; Yao-Chun ; et al.	2020-11-19
Semiconductor Package Structure App 20200365526 - LIN; Tzu-Hung ; et al.	2020-11-19
Semiconductor package structure Grant 10,784,211 - Lin , et al. Sept	2020-09-22
Stacked fan-out package structure Grant 10,692,789 - Liu , et al.	2020-06-23
Semiconductor Package Assembly Having A Conductive Electromagnetic Shield Layer App 20200168572 - Lin; Tzu-Hung ; et al.	2020-05-28
Semiconductor Package Structure App 20200105684 - CHANG; Chia-Cheng ; et al.	2020-04-02
Semiconductor Package Assembly And Method For Forming The Same App 20200075572 - CHANG; Chia-Cheng ; et al.	2020-03-05
Semiconductor Package Structure Having An Annular Frame With Truncated Corners App 20200006289 - Chang; Chia-Cheng ; et al.	2020-01-02
Semiconductor package assembly and method for forming the same Grant 10,497,689 - Chang , et al. De	2019-12-03
Fan-out package structure and method for forming the same Grant 10483211 -	2019-11-19
Semiconductor package assembly Grant 10,468,341 - Liu , et al. No	2019-11-05
Semiconductor package assembly and method for forming the same Grant 10,424,563 - Lin , et al. Sept	2019-09-24
Semiconductor package assembly Grant 10,410,969 - Lin , et al. Sept	2019-09-10
Semiconductor Package Structure Having An Antenna Pattern Electrically Coupled To A First Redistribution Layer (rdl) App 20190252351 - Lin; Tzu-Hung ; et al.	2019-08-15
Semiconductor Package Assembly App 20190131233 - LIU; Nai-Wei ; et al.	2019-05-02
Semiconductor Package Having A Stiffener Ring App 20190115269 - Pan; Chi-Wen ; et al.	2019-04-18
Semiconductor package with improved bandwidth Grant 10,217,723 - Lin , et al. Feb	2019-02-26
Semiconductor package assembly with embedded IPD Grant 10,217,724 - Lin , et al. Feb	2019-02-26
Semiconductor Package Including Lid Structure With Opening And Recess App 20190043771 - CHANG; Chia-Cheng ; et al.	2019-02-07
Semiconductor Package Assembly And Method For Forming The Same App 20190043848 - CHANG; Chia-Cheng ; et al.	2019-02-07
Semiconductor package assembly Grant 10,199,318 - Liu , et al. Fe	2019-02-05
Semiconductor package assembly Grant 10,177,125 - Lin , et al. J	2019-01-08
Stacked Fan-out Package Structure App 20180323127 - Liu; Nai-Wei ; et al.	2018-11-08
Semiconductor Package Structure App 20180269164 - LIN; Tzu-Hung ; et al.	2018-09-20
Semiconductor chip package assembly with improved heat dissipation performance Grant 10,079,192 - Hsiao , et al. September 18, 2	2018-09-18
Semiconductor Package Assembly App 20180233452 - LIN; Tzu-Hung ; et al.	2018-08-16
Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same Grant 10,032,756 - Lin , et al. July 24, 2	2018-07-24
Semiconductor package assembly Grant 9,997,498 - Lin , et al. June 12, 2	2018-06-12
Semiconductor package assembly Grant 9,978,729 - Lin , et al. May 22, 2	2018-05-22
Semiconductor Package With Improved Bandwidth App 20180102343 - Lin; Tzu-Hung ; et al.	2018-04-12
Fan-out package structure having embedded package substrate Grant 9,941,260 - Lin , et al. April 10, 2	2018-04-10
Underfill dispensing in 3D IC using metrology Grant 9,859,181 - Lin , et al. January 2, 2	2018-01-02
Semiconductor Package Structure And Method For Forming The Same App 20170373038 - LIN; Tzu-Hung ; et al.	2017-12-28
Semiconductor Package Assembly App 20170338175 - LIU; Nai-Wei ; et al.	2017-11-23
Semiconductor package structure and method for forming the same Grant 9,786,632 - Lin , et al. October 10, 2	2017-10-10
Semiconductor Package Assembly App 20170287877 - LIN; Tzu-Hung ; et al.	2017-10-05
Semiconductor Package Assembly App 20170278832 - LIN; Tzu-Hung ; et al.	2017-09-28
Fan-out Package Structure And Method For Forming The Same App 20170243826 - LIN; Tzu-Hung ; et al.	2017-08-24
Semiconductor package assembly Grant 9,711,488 - Lin , et al. July 18, 2	2017-07-18
Semiconductor package assembly Grant 9,704,836 - Lin , et al. July 11, 2	2017-07-11
Semiconductor Package Assembly App 20170141041 - LIN; Tzu-Hung ; et al.	2017-05-18
Semiconductor Package Structure And Method For Forming The Same App 20170098628 - LIU; Nai-Wei ; et al.	2017-04-06
Fan-out Wafer Level Package Structure App 20170098589 - LIU; Nai-Wei ; et al.	2017-04-06
Stacked Fan-out Package Structure App 20170098629 - LIU; Nai-Wei ; et al.	2017-04-06
Fan-out Package Structure Having Embedded Package Substrate App 20170077073 - LIN; Tzu-Hung ; et al.	2017-03-16
Structure And Layout Of Ball Grid Array Packages App 20170053884 - Lin; Tzu-Hung ; et al.	2017-02-23
Fan-out Package Structure Including Antenna App 20170040266 - LIN; Tzu-Hung ; et al.	2017-02-09
Semiconductor Package Structure And Method For Forming The Same App 20170033079 - LIN; Tzu-Hung ; et al.	2017-02-02
Semiconductor Package Assembly And Method For Forming The Same App 20160343695 - LIN; Tzu-Hung ; et al.	2016-11-24
Semiconductor Package Assembly And Method For Forming The Same App 20160343685 - LIN; Tzu-Hung ; et al.	2016-11-24
Semiconductor Package Assembly And Method For Forming The Same App 20160343694 - LIN; Tzu-Hung ; et al.	2016-11-24
Semiconductor Chip Package Assembly With Improved Heat Dissipation Performance App 20160329262 - Hsiao; Ching-Wen ; et al.	2016-11-10
Fan-out Package Structure Including Antenna App 20160329299 - LIN; Tzu-Hung ; et al.	2016-11-10
Semiconductor Package Assembly With Embedded Ipd App 20160293581 - LIN; Tzu-Hung ; et al.	2016-10-06
Semiconductor Package Assembly App 20160276324 - LIN; Tzu-Hung ; et al.	2016-09-22
Semiconductor Package Assembly App 20160268234 - LIN; Tzu-Hung ; et al.	2016-09-15
Semiconductor Package Assembly App 20160260693 - Lin; Tzu-Hung ; et al.	2016-09-08
Semiconductor Device Packaging Methods and Structures Thereof App 20160133536 - Lin; Jing-Cheng ; et al.	2016-05-12
Semiconductor Package Assembly App 20160079205 - LIN; Tzu-Hung ; et al.	2016-03-17
Semiconductor device packaging methods and structures thereof Grant 9,245,773 - Lin , et al. January 26, 2	2016-01-26
Display system and method Grant 8,791,912 - Chen , et al. July 29, 2	2014-07-29
Wireless transmission system, device and method Grant 8,738,026 - Chen , et al. May 27, 2	2014-05-27
Semiconductor Device Packaging Methods and Structures Thereof App 20130200529 - Lin; Jing-Cheng ; et al.	2013-08-08
Display System And Method App 20130027321 - CHEN; Yen-Wen ; et al.	2013-01-31
Data Transmission System And Method App 20120250782 - CHEN; Yen-Wen ; et al.	2012-10-04
Wireless Transmission System, Device And Method App 20120040626 - CHEN; Yen-Wen ; et al.	2012-02-16
Method for fabricating polysilicon film Grant 7,939,434 - Tseng , et al. May 10, 2	2011-05-10
Packaging structure and method of an image sensor module Grant 7,572,676 - Leu , et al. August 11, 2	2009-08-11
Element Of Low Temperature Poly-silicon Thin Film And Method Of Making Poly-silicon Thin Film By Direct Deposition At Low Temperature And Inductively-coupled Plasma Chemical Vapor Deposition Equipment Therefor App 20090155988 - PENG; I-Hsuan ; et al.	2009-06-18
Method of direct deposition of polycrystalline silicon Grant 7,521,341 - Wang , et al. April 21, 2	2009-04-21
Method For Fabricating Polysilicon Film, A Gas Phase Deposition Apparatus And An Electronic Device Formed Thereby App 20090020790 - Tseng; Chih-Yuan ; et al.	2009-01-22
Packaging structure and method of an image sensor module Grant 7,411,306 - Leu , et al. August 12, 2	2008-08-12
Low Temperature Direct Deposited Polycrystalline Silicon Thin Film Transistor Structure And Method For Manufacturing The Same App 20070254399 - WANG; Min Chuan ; et al.	2007-11-01
Double gate thin-film transistor and method for forming the same App 20070207574 - Wang; Liang-Tang ; et al.	2007-09-06
Packaging structure and method of an image sensor module App 20070195188 - Leu; Fang-Jun ; et al.	2007-08-23
Method of direct deposition of polycrystalline silicon App 20070105373 - Wang; Liang-Tang ; et al.	2007-05-10
Element of low temperature poly-silicon thin film and method of making poly-silicon thin film by direct deposition at low temperature and inductively-coupled plasma chemical vapor deposition equipment therefor App 20070077735 - Peng; I-Hsuan ; et al.	2007-04-05
Stacked package for electronic elements App 20060220212 - Chen; Shou-Lung ; et al.	2006-10-05
Stacked package for electronic elements and packaging method thereof Grant 7,091,592 - Chen , et al. August 15, 2	2006-08-15
Packaging structure and method of an image sensor module App 20060030070 - Leu; Fang-Jun ; et al.	2006-02-09
Stacked package for electronic elements and packaging method thereof App 20040238933 - Chen, Shou-Lung ; et al.	2004-12-02