Peng, Hsuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Peng, Hsuan.The latest application filed is for "method and apparatus for the formation of laminated circuit having passive components therein".
- Peng, Hsuan - Taipei TW
- Peng, Hsuan - Hsinchu City TW
| Patent | Date |
|---|---|
| Method and apparatus for the formation of laminated circuit having passive components therein App 20030215565 - Chang, Han-Chieh ; et al. | 2003-11-20 |
| Method and device for clamping electromagnetically molds of injection molding machine Grant 6,619,940 - Wang , et al. September 16, 2 | 2003-09-16 |
| Method and apparatus for the formation of laminated circuit having passive componets therein App 20030009726 - Chang, Han-Chieh ; et al. | 2003-01-09 |
| Linkage type mold clamping device driven by electromagnetic force App 20020134181 - Lin, Hsin-Hung ; et al. | 2002-09-26 |
| Apparatus having a moving mold clamping seat for high temperature fluid injection molding App 20020110618 - Tsai, Lang-Fu ; et al. | 2002-08-15 |
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