Peng; Chun-Hung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Peng; Chun-Hung.The latest application filed is for "method for protecting sti structures with low etching rate liners".
- Peng; Chun-Hung - Hsin-Chu TW
- Peng; Chun-Hung - Hsinchu TW
| Patent | Date |
|---|---|
| Method for protecting STI structures with low etching rate liners Grant 6,518,148 - Cheng , et al. February 11, 2 | 2003-02-11 |
| Method for forming via holes Grant 6,080,674 - Wu , et al. June 27, 2 | 2000-06-27 |
| Prolonging a polysilicon layer in smaller memory cells to prevent polysilicon load punch through Grant 5,986,310 - Peng November 16, 1 | 1999-11-16 |
| High load resistance implemented in a separate polysilicon layer with diffusion barrier therein for preventing load punch through therefrom Grant 5,977,598 - Chen , et al. November 2, 1 | 1999-11-02 |
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