Peng; Chin-Hsin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peng; Chin-Hsin.The latest application filed is for "scalable manufacturing system and method for implementing the same".

Company Profile

0.5.7

Peng; Chin-Hsin - HSINCHU CITY TW
Peng; Chin-Hsin - Hsin-Chu TW
Peng; Chin-Hsin - Hsinchu TW
Peng, Chin-Hsin - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Scalable Manufacturing System And Method For Implementing The Same App 20160274569 - Peng; Chin-Hsin	2016-09-22
Systems and methods for temperature control of semiconductor wafers App 20060023395 - Hsiao; Yi-Li ; et al.	2006-02-02
Dual mode hybrid control and method for CMP slurry Grant 6,926,584 - Chang , et al. August 9, 2	2005-08-09
Automatic sensing wafer blade and method for using Grant 6,896,304 - Li , et al. May 24, 2	2005-05-24
Slurry flow control and monitor system for chemical mechanical polisher Grant 6,860,723 - Chen , et al. March 1, 2	2005-03-01
System and method for dry chamber temperature control App 20050016467 - Hsiao, Yi-Li ; et al.	2005-01-27
Multi-phase pressure control valve for process chamber Grant 6,843,264 - Chang , et al. January 18, 2	2005-01-18
Multi - phase pressure control valve for process chamber App 20040118464 - Chang, Chih-Tien ; et al.	2004-06-24
Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming Grant 6,733,373 - Yang , et al. May 11, 2	2004-05-11
Slurry flow control and monitor system for chemical mechanical polisher App 20040071555 - Chen, Ping-Hsu ; et al.	2004-04-15
Dual mode hybrid control and method for CMP slurry App 20040072503 - Chang, Chao-Jung ; et al.	2004-04-15
Automatic sensing wafer blade and method for using App 20040041421 - Hsiao, Yi-Li ; et al.	2004-03-04

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