Peng; Chih-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peng; Chih-Ping.The latest application filed is for "lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting".

Company Profile

0.14.13

Peng; Chih-Ping - Taipei TW
Peng; Chih-Ping - Hsinchu TW
Peng; Chih-Ping - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting Grant 10,163,762 - Ding , et al. Dec	2018-12-25
Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage current Grant 9,966,429 - Chen , et al. May 8, 2	2018-05-08
Lead Frame With Conductive Clip For Mounting A Semiconductor Die With Reduced Clip Shifting App 20160365305 - Ding; Hui-Ying ; et al.	2016-12-15
Zener diode having a polysilicon layer for improved reverse surge capability and decreased leakage current Grant 9,331,142 - Chen , et al. May 3, 2	2016-05-03
Zener diode haviing a polysilicon layer for improved reverse surge capability and decreased leakage current Grant 9,202,935 - Chen , et al. December 1, 2	2015-12-01
Zener Diode Haviing A Polysilicon Layer For Improved Reverse Surge Capability And Decreased Leakage Current App 20150340458 - Chen; Shih-Kuan ; et al.	2015-11-26
Zener Diode Haviing A Polysilicon Layer For Improved Reverse Surge Capability And Decreased Leakage Current App 20150340431 - Chen; Shih-Kuan ; et al.	2015-11-26
Axial semiconductor package Grant 9,041,188 - Chiang , et al. May 26, 2	2015-05-26
Zener Diode Haviing A Polysilicon Layer For Improved Reverse Surge Capability And Decreased Leakage Current App 20150091136 - Chen; Shih-Kuan ; et al.	2015-04-02
Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Grant 8,796,840 - Chiang , et al. August 5, 2	2014-08-05
Axial Semiconductor Package App 20140131842 - Chiang; Wan-Lan ; et al.	2014-05-15
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Grant 8,252,633 - Chiang , et al. August 28, 2	2012-08-28
Semiconductor Assembly That Includes A Power Semiconductor Die Located On A Cell Defined By First And Second Patterned Polymer Layers App 20120168932 - Chiang; Wan-Lan ; et al.	2012-07-05
Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer Grant 8,138,597 - Chiang , et al. March 20, 2	2012-03-20
Subassembly That Includes A Power Semiconductor Die And A Heat Sink Having An Exposed Surface Portion Thereof App 20110171784 - Chiang; Wan-Lan ; et al.	2011-07-14
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof Grant 7,915,728 - Chiang , et al. March 29, 2	2011-03-29
Semiconductor Assembly That Includes A Power Semiconductor Die Located On A Cell Defined By First And Second Patterned Polymer Layers App 20110049700 - Chiang; Wan-Lan ; et al.	2011-03-03
Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Grant 7,838,985 - Chiang , et al. November 23, 2	2010-11-23
Method for maintaining vacuum-tight inside a panel module and structure for the same Grant 7,821,189 - Peng , et al. October 26, 2	2010-10-26
Method for maintaining vacuum-tight inside a panel module and structure for the same Grant 7,780,494 - Peng , et al. August 24, 2	2010-08-24
Method for maintaining vacuum-tight inside a panel module and structure for the same App 20090139645 - Peng; Chih-Ping ; et al.	2009-06-04
Field emission system and method for improving its vacuum Grant 7,489,071 - Chien , et al. February 10, 2	2009-02-10
Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof App 20090014862 - Chiang; Wan-Lan ; et al.	2009-01-15
Subassembly that includes a power semiconductor die and a heat sink and method of forming same App 20090014863 - Chiang; Wan-Lan ; et al.	2009-01-15
Field emission system and method for improving its vacuum App 20080042547 - Chien; Yu-Han ; et al.	2008-02-21
Method for maintaining vacuum-tight inside a panel module and structure for the same App 20070210695 - Peng; Chih-Ping ; et al.	2007-09-13

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