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Semiconductor Device Including Liner Structure
App 20210407852 - Yeh; Ching-Fu ; et al. | 2021-12-30 |
Method of semiconductor integrated circuit fabrication
Grant 10,930,552 - Yeh , et al. February 23, 2 | 2021-02-23 |
Selective Formation of Conductor Nanowires
App 20200091068 - Peng; Chao-Hsien ; et al. | 2020-03-19 |
Method of Semiconductor Integrated Circuit Fabrication
App 20200051857 - Yeh; Ching-Fu ; et al. | 2020-02-13 |
Selective formation of conductor nanowires
Grant 10,490,497 - Peng , et al. Nov | 2019-11-26 |
Method of semiconductor integrated circuit fabrication
Grant 10,453,746 - Yeh , et al. Oc | 2019-10-22 |
Method of Semiconductor Integrated Circuit Fabrication
App 20180233406 - Yeh; Ching-Fu ; et al. | 2018-08-16 |
Method of semiconductor integrated circuit fabrication
Grant 9,947,583 - Yeh , et al. April 17, 2 | 2018-04-17 |
Lithography using multilayer spacer for reduced spacer footing
Grant 9,892,933 - Peng , et al. February 13, 2 | 2018-02-13 |
Method of manufacturing a semiconductor device
Grant 9,837,310 - Peng , et al. December 5, 2 | 2017-12-05 |
Via pre-fill on back-end-of-the-line interconnect layer
Grant 9,728,503 - Peng , et al. August 8, 2 | 2017-08-08 |
Method of forming metal interconnection
Grant 9,721,887 - Peng , et al. August 1, 2 | 2017-08-01 |
Method of Semiconductor Integrated Circuit Fabrication
App 20170170066 - Yeh; Ching-Fu ; et al. | 2017-06-15 |
Method for forming interconnect structure that avoids via recess
Grant 9,646,932 - Peng , et al. May 9, 2 | 2017-05-09 |
Method of Forming Metal Interconnection
App 20170053864 - Peng; Chao-Hsien ; et al. | 2017-02-23 |
Method of semiconductor integrated circuit fabrication
Grant 9,570,347 - Yeh , et al. February 14, 2 | 2017-02-14 |
Method for forming recess-free interconnect structure
Grant 9,385,029 - Peng , et al. July 5, 2 | 2016-07-05 |
Method for Forming Interconnect Structure that Avoids via Recess
App 20160148874 - Peng; Chao-Hsien ; et al. | 2016-05-26 |
Via Pre-fill On Back-end-of-the-line Interconnect Layer
App 20160049373 - Peng; Chao-Hsien ; et al. | 2016-02-18 |
Method for forming interconnect structure that avoids via recess
Grant 9,252,049 - Peng , et al. February 2, 2 | 2016-02-02 |
Lithography using Multilayer Spacer for Reduced Spacer Footing
App 20160027658 - Peng; Chao-Hsien ; et al. | 2016-01-28 |
Via pre-fill on back-end-of-the-line interconnect layer
Grant 9,219,033 - Peng , et al. December 22, 2 | 2015-12-22 |
Selective Formation of Conductor Nanowires
App 20150364413 - Peng; Chao-Hsien ; et al. | 2015-12-17 |
Lithography using multilayer spacer for reduced spacer footing
Grant 9,159,579 - Peng , et al. October 13, 2 | 2015-10-13 |
Method of Semiconductor Integrated Circuit Fabrication
App 20150270170 - Yeh; Ching-Fu ; et al. | 2015-09-24 |
Via Pre-fill On Back-end-of-the-line Interconnect Layer
App 20150270215 - Peng; Chao-Hsien ; et al. | 2015-09-24 |
Interconnect Structures Comprising Flexible Buffer Layers
App 20150214102 - Peng; Chao-Hsien ; et al. | 2015-07-30 |
Method of semiconductor integrated circuit fabrication
Grant 9,054,161 - Yeh , et al. June 9, 2 | 2015-06-09 |
Method for Forming Recess-Free Interconnect Structure
App 20150145134 - Peng; Chao-Hsien ; et al. | 2015-05-28 |
Method Of Manufacturing A Semiconductor Device
App 20150132947 - Peng; Chao-Hsien ; et al. | 2015-05-14 |
Interconnect structures comprising flexible buffer layers
Grant 9,030,013 - Peng , et al. May 12, 2 | 2015-05-12 |
Lithography using Multilayer Spacer for Reduced Spacer Footing
App 20150118850 - Peng; Chao-Hsien ; et al. | 2015-04-30 |
Method of fabricating copper damascene
Grant 8,916,469 - Peng , et al. December 23, 2 | 2014-12-23 |
Method for forming recess-free interconnect structure
Grant 8,912,041 - Peng , et al. December 16, 2 | 2014-12-16 |
Method Of Fabricating Copper Damascene
App 20140273434 - Peng; Chao-Hsien ; et al. | 2014-09-18 |
Method for Forming Recess-Free Interconnect Structure
App 20140252622 - Peng; Chao-Hsien ; et al. | 2014-09-11 |
Method For Forming Interconnect Structure That Avoids Via Recess
App 20140252618 - Peng; Chao-Hsien ; et al. | 2014-09-11 |
Method of semiconductor integrated circuit fabrication
Grant 8,735,280 - Yeh , et al. May 27, 2 | 2014-05-27 |
Interconnect Structures Comprising Flexible Buffer Layers
App 20140084471 - Peng; Chao-Hsien ; et al. | 2014-03-27 |
Method for forming composite barrier layer
Grant 8,034,709 - Huang , et al. October 11, 2 | 2011-10-11 |
Method for forming composite barrier layer
App 20090047780 - Huang; Cheng-Lin ; et al. | 2009-02-19 |
Composite barrier layer
Grant 7,453,149 - Huang , et al. November 18, 2 | 2008-11-18 |
Method for forming a semiconductor device
Grant 7,405,151 - Wang , et al. July 29, 2 | 2008-07-29 |
Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer
Grant 7,338,903 - Peng , et al. March 4, 2 | 2008-03-04 |
High performance metallization cap layer
Grant 7,253,501 - Lee , et al. August 7, 2 | 2007-08-07 |
Semiconductor device and fabrication method thereof
App 20070152306 - Shih; Chien-Hsueh ; et al. | 2007-07-05 |
Atomic layer deposition tantalum nitride layer to improve adhesion between a copper structure and overlying materials
Grant 7,202,162 - Lin , et al. April 10, 2 | 2007-04-10 |
Semiconductor Device And Fabrication Method Thereof
App 20060205235 - Wang; Gin Jei ; et al. | 2006-09-14 |
Semiconductor device and fabrication method thereof
Grant 7,078,810 - Wang , et al. July 18, 2 | 2006-07-18 |
Semiconductor device and fabrication method thereof
App 20060113673 - Wang; Gin Jie ; et al. | 2006-06-01 |
High performance metallization cap layer
App 20060027922 - Lee; Hsien-Ming ; et al. | 2006-02-09 |
Composite barrier layer
App 20060027925 - Huang; Cheng-Lin ; et al. | 2006-02-09 |
Method for fabricating low resistivity barrier for copper interconnect
App 20050277292 - Peng, Chao-Hsien ; et al. | 2005-12-15 |
Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer
App 20050239288 - Peng, Chao-Hsien ; et al. | 2005-10-27 |
Pre-clean chamber with wafer heating apparatus and method of use
App 20050189075 - Pan, Shing-Chyang ; et al. | 2005-09-01 |
Method of multi-element compound deposition by atomic layer deposition for IC barrier layer applications
App 20050045092 - Wu, Chii-Ming ; et al. | 2005-03-03 |
Atomic layer deposited tantalum nitride layer to improve adhesion between a copper structure and overlying materials
App 20040214425 - Lin, Jing-Cheng ; et al. | 2004-10-28 |
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