Peng; Bryan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peng; Bryan.The latest application filed is for "multiple chips bonded to packaging structure with low noise and multiple selectable functions".

Company Profile

0.7.7

Peng; Bryan - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multiple chips bonded to packaging structure with low noise and multiple selectable functions Grant 8,148,806 - Lin , et al. April 3, 2	2012-04-03
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20090057919 - Lin; Mou-Shiung ; et al.	2009-03-05
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20090056988 - Lin; Mou-Shiung ; et al.	2009-03-05
Multiple chips bonded to packaging structure with low noise and multiple selectable functions Grant 7,468,551 - Lin , et al. December 23, 2	2008-12-23
Chip package with capacitor Grant 7,247,932 - Lin , et al. July 24, 2	2007-07-24
Electronic device and chip package Grant 7,205,646 - Lin , et al. April 17, 2	2007-04-17
Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board Grant 7,045,901 - Lin , et al. May 16, 2	2006-05-16
Multiple chips bonded to packaging structure with low noise and multiple selectable functions Grant 6,791,192 - Lin , et al. September 14, 2	2004-09-14
Multiple chips bonded to packaging structure with low noise and multiple selectable functions Grant 6,768,208 - Lin , et al. July 27, 2	2004-07-27
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20030205826 - Lin, Mou-Shiung ; et al.	2003-11-06
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20030201545 - Lin, Mou-Shiung ; et al.	2003-10-30
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20030197287 - Lin, Mou-Shiung ; et al.	2003-10-23
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20030127749 - Lin, Mou-Shiung ; et al.	2003-07-10
Multiple chips bonded to packaging structure with low noise and multiple selectable functions App 20030122240 - Lin, Mou-Shiung ; et al.	2003-07-03

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