loadpatents
Patent applications and USPTO patent grants for Peethala; Cornelius B..The latest application filed is for "back end of line integration for interconnects".
Patent | Date |
---|---|
Wet clean solutions to prevent pattern collapse Grant 11,094,527 - Peethala , et al. August 17, 2 | 2021-08-17 |
Conductive interconnect having a semi-liner and no top surface recess Grant 11,004,735 - Peethala , et al. May 11, 2 | 2021-05-11 |
Low oxygen cleaning for CMP equipment Grant 10,832,917 - Canaperi , et al. November 10, 2 | 2020-11-10 |
Back End Of Line Integration For Interconnects App 20200219759 - Peethala; Cornelius B. ;   et al. | 2020-07-09 |
Back end of line integration for interconnects Grant 10,699,945 - Peethala , et al. | 2020-06-30 |
Wet Clean Solutions To Prevent Pattern Collapse App 20200118808 - Peethala; Cornelius B. ;   et al. | 2020-04-16 |
Back End Of Line Integration For Interconnects App 20200111699 - Peethala; Cornelius B. ;   et al. | 2020-04-09 |
Conductive Interconnect Having A Semi-liner And No Top Surface Recess App 20200090988 - Peethala; Cornelius B. ;   et al. | 2020-03-19 |
Rework of patterned dielectric and metal hardmask films Grant 10,242,872 - Arnold , et al. | 2019-03-26 |
Wet etch removal of Ru selective to other metals Grant 10,242,909 - Briggs , et al. | 2019-03-26 |
Low Oxygen Cleaning For Cmp Equipment App 20180358231 - Canaperi; Donald F. ;   et al. | 2018-12-13 |
Low Oxygen Cleaning For Cmp Equipment App 20180358230 - Canaperi; Donald F. ;   et al. | 2018-12-13 |
WET ETCH REMOVAL OF Ru SELECTIVE TO OTHER METALS App 20180323151 - Briggs; Benjamin D. ;   et al. | 2018-11-08 |
Semiconductor device formed by wet etch removal of Ru selective to other metals Grant 10,090,247 - Briggs , et al. October 2, 2 | 2018-10-02 |
Rework Of Patterned Dielectric And Metal Hardmask Films App 20180277369 - Arnold; John C. ;   et al. | 2018-09-27 |
Selective and non-selective barrier layer wet removal Grant 10,002,831 - Briggs , et al. June 19, 2 | 2018-06-19 |
Barrier Planarization For Interconnect Metallization App 20180114718 - Briggs; Benjamin D. ;   et al. | 2018-04-26 |
Barrier Planarization For Interconnect Metallization App 20180114719 - Briggs; Benjamin D. ;   et al. | 2018-04-26 |
Barrier planarization for interconnect metallization Grant 9,881,833 - Briggs , et al. January 30, 2 | 2018-01-30 |
Selective And Non-selective Barrier Layer Wet Removal App 20170317026 - Briggs; Benjamin D. ;   et al. | 2017-11-02 |
Selective and non-selective barrier layer wet removal Grant 9,806,023 - Briggs , et al. October 31, 2 | 2017-10-31 |
Selective And Non-selective Barrier Layer Wet Removal App 20170301624 - Briggs; Benjamin D. ;   et al. | 2017-10-19 |
Selective and non-selective barrier layer wet removal Grant 9,685,406 - Briggs , et al. June 20, 2 | 2017-06-20 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.