loadpatents
name:-0.0046920776367188
name:-0.0075960159301758
name:-0.0013058185577393
Pedron, Jr.; Serafin P. Patent Filings

Pedron, Jr.; Serafin P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pedron, Jr.; Serafin P..The latest application filed is for "leadless integrated circuit package having standoff contacts and die attach pad".

Company Profile
0.8.3
  • Pedron, Jr.; Serafin P. - Manteca CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Leadless integrated circuit package having standoff contacts and die attach pad
Grant 9,305,889 - Powell , et al. April 5, 2
2016-04-05
Leadless Integrated Circuit Package Having Standoff Contacts And Die Attach Pad
App 20140367865 - POWELL; Kirk ;   et al.
2014-12-18
Leadless array plastic package with various IC packaging configurations
Grant 8,828,801 - McMillan , et al. September 9, 2
2014-09-09
Leadless integrated circuit package having standoff contacts and die attach pad
Grant 8,736,037 - Powell , et al. May 27, 2
2014-05-27
Leadless Array Plastic Package With Various Ic Packaging Configurations
App 20130273692 - MCMILLAN; John ;   et al.
2013-10-17
Leadless array plastic package with various IC packaging configurations
Grant 8,486,762 - McMillan , et al. July 16, 2
2013-07-16
Leadless Array Plastic Package With Various Ic Packaging Configurations
App 20120052631 - Mcmillan; John ;   et al.
2012-03-01
Stacked semiconductor package and method of manufacturing the same
Grant 6,818,980 - Pedron, Jr. November 16, 2
2004-11-16
Semiconductor package having a ground or power ring and a metal substrate
Grant 5,877,551 - Tostado , et al. March 2, 1
1999-03-02

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