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Patent applications and USPTO patent grants for Pedretti, Giuseppe.The latest application filed is for "process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer".
Patent | Date |
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Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer App 20040168314 - Pedretti, Giuseppe ;   et al. | 2004-09-02 |
Component for multilayer printed circuit board, method of production thereof and associated multilayer printed circuit board Grant 6,709,769 - Pedretti March 23, 2 | 2004-03-23 |
Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer Grant 6,651,324 - Pedretti , et al. November 25, 2 | 2003-11-25 |
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