Pedder; David J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pedder; David J..The latest application filed is for "apparatus and method for testing bare dies with low contact resistance between the die and testing station".
- Pedder; David J. - Long Compton GB
- Pedder; David J. - Oxford GB3
- Pedder; David J. - Warwickshire GB2
- Pedder; David J. - Oxon GB3
- Pedder; David J. - Warks
| Patent | Date |
|---|---|
| Apparatus and method for testing bare dies with low contact resistance between the die and testing station Grant 5,406,210 - Pedder April 11, 1 | 1995-04-11 |
| Hybrid structures Grant 5,185,613 - Whatmore , et al. February 9, 1 | 1993-02-09 |
| Flip chip solder bond structure for devices with gold based metallization Grant 5,108,027 - Warner , et al. April 28, 1 | 1992-04-28 |
| Vernier structure for flip chip bonded devices Grant 5,022,580 - Pedder June 11, 1 | 1991-06-11 |
| Metal surface cleaning processes Grant 5,000,819 - Pedder , et al. March 19, 1 | 1991-03-19 |
| Pyroelectric detectors Grant 4,317,063 - Pedder , et al. February 23, 1 | 1982-02-23 |
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