| Patent | Date |
|---|
Protective device for electronic device
Grant 11,046,496 - Pearson , et al. June 29, 2 | 2021-06-29 |
Self-seating System And Method
App 20210080262 - O'Shea; Terrance J ; et al. | 2021-03-18 |
Protective Device For Electronic Device
App 20190241341 - Pearson; Tom E. ; et al. | 2019-08-08 |
Electronic wearable device electrode pad with collection well
Grant 10,063,074 - O'Shea , et al. August 28, 2 | 2018-08-28 |
Electronic Wearable Device Electrode Pad With Collection Well
App 20170288432 - OShea; Terry ; et al. | 2017-10-05 |
Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies
Grant 9,420,700 - Vreman , et al. August 16, 2 | 2016-08-16 |
Wireless peripheral data transmission for touchscreen displays
Grant 9,367,174 - Roberts , et al. June 14, 2 | 2016-06-14 |
Inclined Photonic Chip Package For Integrated Optical Transceivers & Optical Touchscreen Assemblies
App 20160088740 - VREMAN; Gerrit J. ; et al. | 2016-03-24 |
Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies
Grant 9,263,621 - Vreman , et al. February 16, 2 | 2016-02-16 |
Data Transmission For Touchscreen Displays
App 20150277613 - ROBERTS; Richard D. ; et al. | 2015-10-01 |
Inclined Photonic Chip Package For Integrated Optical Transceivers & Optical Touchscreen Assemblies
App 20150185895 - VREMAN; Gerrit J ; et al. | 2015-07-02 |
Temporal based motion sensor reporting
Grant 8,901,476 - O'Shea , et al. December 2, 2 | 2014-12-02 |
Temporal Based Motion Sensor Reporting
App 20140002270 - O'Shea; Terrance J. ; et al. | 2014-01-02 |
Temporal based motion sensor reporting
Grant 8,525,099 - O'Shea , et al. September 3, 2 | 2013-09-03 |
Temporal Based Motion Sensor Reporting
App 20120155602 - O'Shea; Terrance J. ; et al. | 2012-06-21 |
Method and structure for identifying lead-free solder
Grant 7,251,880 - Pearson , et al. August 7, 2 | 2007-08-07 |
Capacitor placement for integrated circuit packages
Grant 7,230,317 - Pearson , et al. June 12, 2 | 2007-06-12 |
Method of creating solder bar connections on electronic packages
Grant 7,185,799 - Pearson , et al. March 6, 2 | 2007-03-06 |
Soldered heat sink anchor and method of use
Grant 7,183,496 - Arrigotti , et al. February 27, 2 | 2007-02-27 |
Structural reinforcement for electronic substrate
Grant 7,161,238 - Hsieh , et al. January 9, 2 | 2007-01-09 |
Heat-shrinkable retainer for PCB double-sided assembly
Grant 7,131,193 - Fartash , et al. November 7, 2 | 2006-11-07 |
Ceramic embedded wireless antenna
Grant 7,122,891 - Dishongh , et al. October 17, 2 | 2006-10-17 |
RFID embedded in device
App 20060109121 - Dishongh; Terry J. ; et al. | 2006-05-25 |
Methods of manufacturing via intersect pad for electronic components
Grant 7,036,217 - Pearson , et al. May 2, 2 | 2006-05-02 |
Capacitor placement for integrated circuit packages
App 20060049479 - Pearson; Tom E. ; et al. | 2006-03-09 |
Infrared transmissive integrated circuit socket cap
App 20050218035 - Pearson, Tom E. ; et al. | 2005-10-06 |
Method of creating solder bar connections on electronic packages
App 20050211750 - Pearson, Tom E. ; et al. | 2005-09-29 |
Extension mechanism and method for assembling overhanging components
Grant 6,917,524 - Pearson , et al. July 12, 2 | 2005-07-12 |
Ceramic embedded wireless antenna
App 20050134507 - Dishongh, Terrance ; et al. | 2005-06-23 |
Electronic assembly with thermally separated support
Grant 6,903,271 - Pearson , et al. June 7, 2 | 2005-06-07 |
Constructing of an electronic assembly having a decoupling capacitor
App 20050090041 - Dishongh, Terrance J. ; et al. | 2005-04-28 |
Constructing of an electronic assembly having a decoupling capacitor
Grant 6,884,939 - Dishongh , et al. April 26, 2 | 2005-04-26 |
Retainer for circuit board assembly and method for using the same
Grant 6,875,931 - Combs , et al. April 5, 2 | 2005-04-05 |
Electronic Assembly With Thermally Separated Support
App 20050067178 - Pearson, Tom E. ; et al. | 2005-03-31 |
Extension mechanism and method for assembling overhanging components
App 20050014419 - Pearson, Tom E. ; et al. | 2005-01-20 |
Constructing of an electronic assembly having a decoupling capacitor
App 20040256133 - Dishongh, Terrance J. ; et al. | 2004-12-23 |
Zero mounting force solder-free connector/component and method
Grant 6,817,878 - Combs , et al. November 16, 2 | 2004-11-16 |
Heat-shrinkable retainer for PCB double-sided assembly
App 20040209508 - Fartash, Arjang ; et al. | 2004-10-21 |
Soldered heat sink anchor and method of use
App 20040207076 - Arrigotti, George ; et al. | 2004-10-21 |
Extension mechanism and method for assembling overhanging components
Grant 6,801,436 - Pearson , et al. October 5, 2 | 2004-10-05 |
Epoxy washer for retention of inverted SMT components
Grant 6,791,189 - Pearson , et al. September 14, 2 | 2004-09-14 |
Zero insertion force heat-activated retention pin
Grant 6,764,325 - Arrigotti , et al. July 20, 2 | 2004-07-20 |
Structural reinforcement for electronic substrate
App 20040124517 - Hsieh, George ; et al. | 2004-07-01 |
Built up lands
App 20040124006 - Pearson, Tom E. ; et al. | 2004-07-01 |
Soldered heat sink anchor and method of use
Grant 6,734,371 - Arrigotti , et al. May 11, 2 | 2004-05-11 |
Retainer for circuit board assembly and method for using the same
Grant 6,700,800 - Combs , et al. March 2, 2 | 2004-03-02 |
Methods for retaining assembled components
Grant 6,691,407 - Pearson , et al. February 17, 2 | 2004-02-17 |
Retainer for circuit board assembly and method for using the same
App 20040011557 - Combs, Christopher D. ; et al. | 2004-01-22 |
Retainer For Circuit Board Assembly And Method For Using The Same
App 20030231481 - Combs, Christopher ; et al. | 2003-12-18 |
Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
Grant 6,651,869 - Aspandiar , et al. November 25, 2 | 2003-11-25 |
Zero insertion force heat-activated retention pin
App 20030216066 - Arrigotti, George ; et al. | 2003-11-20 |
Zero mounting force solder-free connector/component and method
App 20030124885 - Combs, Christopher D. ; et al. | 2003-07-03 |
Heat-shrinkable retainer for PCB double-sided assembly
App 20030111260 - Fartash, Arjang ; et al. | 2003-06-19 |
Epoxy washer for retention of inverted SMT components
App 20030111258 - Pearson, Tom E. ; et al. | 2003-06-19 |
Epoxy washer for retention of inverted SMT components
App 20030111259 - Pearson, Tom E. ; et al. | 2003-06-19 |
Methods of manufacturing via intersect pad for electronic components
App 20030101585 - Pearson, Tom E. ; et al. | 2003-06-05 |
Extension mechanism and method for assembling overhanging components
App 20030061709 - Pearson, Tom E. ; et al. | 2003-04-03 |
Soldered heat sink anchor and method of use
App 20030062195 - Arrigotti, George ; et al. | 2003-04-03 |
Method and structure for identifying lead-free solder
App 20030062192 - Pearson, Tom E. ; et al. | 2003-04-03 |
Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
App 20030057265 - Aspandiar, Raiyomand F. ; et al. | 2003-03-27 |
Heatsink mounting with shock absorbers
Grant 6,501,658 - Pearson , et al. December 31, 2 | 2002-12-31 |
Via Intersect Pad For Electronic Components And Methods Of Manufacture
App 20020195269 - Pearson, Tom E. ; et al. | 2002-12-26 |
Printed Circuit Board With Embedded Thermocouple Junctions
App 20020139575 - Fartash, Arjang ; et al. | 2002-10-03 |
Heatsink mounting with shock absorbers
App 20020114137 - Pearson, Tom E. ; et al. | 2002-08-22 |
Plastic package with pull tab
Grant D456,249 - Pearson , et al. April 30, 2 | 2002-04-30 |
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