loadpatents
name:-0.0099601745605469
name:-0.0050311088562012
name:-0.002161979675293
Payne; Makonnen Patent Filings

Payne; Makonnen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Payne; Makonnen.The latest application filed is for "post-etch residue removal for advanced node beol processing".

Company Profile
2.6.11
  • Payne; Makonnen - White Plains NY
  • Payne; Makonnen - San Jose CA
  • Payne; Makonnen - Mount Vernon NY US
  • Payne; Makonnen - US
  • Payne, Makonnen - Bronx NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Post-etch residue removal for advanced node beol processing
Grant 10,790,187 - Cooper , et al. September 29, 2
2020-09-29
Cleaning compositions for removing post etch residue
Grant 10,577,567 - Payne , et al.
2020-03-03
Post-etch Residue Removal For Advanced Node Beol Processing
App 20180204764 - Cooper; Emanuel I. ;   et al.
2018-07-19
Cleaning Compositions For Removing Post Etch Residue
App 20180148669 - Payne; Makonnen ;   et al.
2018-05-31
Composition for and method of suppressing titanium nitride corrosion
Grant 9,416,338 - Cooper , et al. August 16, 2
2016-08-16
Facilities manifold with proximity sensor
Grant 9,031,700 - Payne , et al. May 12, 2
2015-05-12
Wet Processing Systems and Methods with Replenishment
App 20140273497 - Payne; Makonnen ;   et al.
2014-09-18
Composition For And Method Of Suppressing Titanium Nitride Corrosion
App 20130303420 - Cooper; Emanuel I. ;   et al.
2013-11-14
Method For Preventing The Collapse Of High Aspect Ratio Structures During Drying
App 20130280123 - Chen; Tianniu ;   et al.
2013-10-24
Facilites Manifold with Proximity Sensor
App 20130090765 - Payne; Makonnen ;   et al.
2013-04-11
Dry cleansing wipe with improved rinsibility
App 20030140439 - Durden, Catherine ;   et al.
2003-07-31
Dry cleansing wipe with improved rinsibility
App 20030143263 - Durden, Catherine ;   et al.
2003-07-31

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