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name:-0.0076360702514648
name:-0.0092759132385254
name:-0.0037198066711426
Pawar; Vivek Devidas Patent Filings

Pawar; Vivek Devidas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pawar; Vivek Devidas.The latest application filed is for "applications of diffusion hardening techniques".

Company Profile
2.11.8
  • Pawar; Vivek Devidas - Germantown TN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Applications of diffusion hardening techniques
Grant 11,351,031 - Band , et al. June 7, 2
2022-06-07
Applications Of Diffusion Hardening Techniques
App 20200078179 - Band; Timothy John ;   et al.
2020-03-12
Applications of diffusion hardening techniques
Grant 10,512,544 - Band , et al. Dec
2019-12-24
Applications Of Diffusion Hardening Techniques
App 20180042727 - Band; Timothy John ;   et al.
2018-02-15
Application of diffusion hardened material
Grant 9,681,955 - Jordan , et al. June 20, 2
2017-06-20
Ceramic layered medical implant
Grant 9,414,924 - Pawar , et al. August 16, 2
2016-08-16
Application Of Diffusion Hardened Material
App 20160095707 - Jordan; Jason Sean ;   et al.
2016-04-07
Application of diffusion hardened material
Grant 9,180,012 - Jordan , et al. November 10, 2
2015-11-10
Ceramic metal composite for orthopaedic implants
Grant 9,107,980 - Jani , et al. August 18, 2
2015-08-18
Application Of Diffusion Hardened Material
App 20140330389 - Jordan; Jason Sean ;   et al.
2014-11-06
Ceramic Layered Medical Implant
App 20130230640 - PAWAR; Vivek Devidas ;   et al.
2013-09-05
Ceramic layered medical implant
Grant 8,415,019 - Pawar , et al. April 9, 2
2013-04-09
Ceramic metal composite for orthopaedic implants
Grant 8,257,835 - Jani , et al. September 4, 2
2012-09-04
Ceramic Layered Medical Implant
App 20100174383 - Pawar; Vivek Devidas ;   et al.
2010-07-08
Ceramic Metal Composite For Orthopaedic Implants
App 20090187255 - Jani; Shilesh C. ;   et al.
2009-07-23

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