Pavone; Salvatore
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pavone; Salvatore.The latest application filed is for "die attach surface copper layer with protective layer for microelectronic devices".
- Pavone; Salvatore - Murphy TX
| Patent | Date |
|---|---|
| Die Attach Surface Copper Layer With Protective Layer For Microelectronic Devices App 20200185309 - Manack; Christopher Daniel ; et al. | 2020-06-11 |
| Opening in a multilayer polymeric dielectric layer without delamination Grant 10,546,821 - Han , et al. Ja | 2020-01-28 |
| Opening In A Multilayer Polymeric Dielectric Layer Without Delamination App 20170033057 - Han; Licheng Marshal ; et al. | 2017-02-02 |
| Opening in a multilayer polymeric dielectric layer without delamination Grant 9,502,365 - Han , et al. November 22, 2 | 2016-11-22 |
| Opening In A Multilayer Polymeric Dielectric Layer Without Delamination App 20150187711 - Han; Licheng Marshal ; et al. | 2015-07-02 |
| Three-step chamber cleaning process for deposition tools App 20040261815 - Pavone, Salvatore | 2004-12-30 |
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