Patent | Date |
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Measurement Of Total Accelerator In An Electrodeposition Solution App 20180202060 - Pavlov; Michael ;   et al. | 2018-07-19 |
Palladium coating thickness measurement Grant 9,593,931 - Tench , et al. March 14, 2 | 2017-03-14 |
Palladium Coating Thickness Measurement App 20140061064 - Tench; D. Morgan ;   et al. | 2014-03-06 |
Analysis of an auxiliary leveler additive in an acid copper plating bath Grant 8,535,504 - Pavlov , et al. September 17, 2 | 2013-09-17 |
Chloride analysis in acid copper plating baths Grant 8,142,640 - Pavlov , et al. March 27, 2 | 2012-03-27 |
Analysis of copper ion and complexing agent in copper plating baths Grant 8,118,988 - Shalyt , et al. February 21, 2 | 2012-02-21 |
Analysis of an auxiliary leveler additive in an acid copper plating bath App 20110266154 - Pavlov; Michael ;   et al. | 2011-11-03 |
Detection of additive breakdown products in acid copper plating baths Grant 7,879,222 - Shalyt , et al. February 1, 2 | 2011-02-01 |
Analysis of fluoride at low concentrations in acidic processing solutions App 20090229995 - Shalyt; Eugene ;   et al. | 2009-09-17 |
Analysis of copper ion and complexing agent in copper plating baths App 20090194430 - Shalyt; Eugene ;   et al. | 2009-08-06 |
Chloride analysis in acid copper plating baths App 20090065362 - Pavlov; Michael ;   et al. | 2009-03-12 |
Detection of additive breakdown products in acid copper plating baths App 20090057151 - Shalyt; Eugene ;   et al. | 2009-03-05 |
Detection of an unstable additive breakdown product in a plating bath Grant 7,291,253 - Pavlov , et al. November 6, 2 | 2007-11-06 |
Efficient analysis of organic additives in an acid copper plating bath Grant 7,186,326 - Shalyt , et al. March 6, 2 | 2007-03-06 |
Efficient analysis of organic additives in an acid copper plating bath App 20050263399 - Shalyt, Eugene ;   et al. | 2005-12-01 |
Detection of an unstable additive breakdown product in a plating bath App 20050247577 - Pavlov, Michael ;   et al. | 2005-11-10 |
Measurement of complexing agent concentration in an electroless plating bath Grant 6,890,758 - Shalyt , et al. May 10, 2 | 2005-05-10 |
Measurement of complexing agent concentration in an electroless plating bath App 20040253740 - Shalyt, Eugene ;   et al. | 2004-12-16 |
Detection of suppressor breakdown contaminants in a plating bath Grant 6,749,739 - Chalyt , et al. June 15, 2 | 2004-06-15 |
Voltammetric reference electrode calibration Grant 6,733,656 - Chalyt , et al. May 11, 2 | 2004-05-11 |
Detection of suppressor breakdown contaminants in a plating bath App 20040065561 - Chalyt, Gene ;   et al. | 2004-04-08 |
Measurement of the concentration of a reducing agent in an electroless plating bath Grant 6,709,561 - Pavlov , et al. March 23, 2 | 2004-03-23 |
Voltammetric measurement of halide ion concentration Grant 6,673,226 - Kogan , et al. January 6, 2 | 2004-01-06 |
Voltammetric reference electrode calibration App 20030188977 - Chalyt, Gene ;   et al. | 2003-10-09 |
Method for analysis of three organic additives in an acid copper plating bath App 20030062266 - Chalyt, Gene ;   et al. | 2003-04-03 |
Vibration responsive barbed tape security system Grant 5,530,430 - Pavlov June 25, 1 | 1996-06-25 |