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Patent applications and USPTO patent grants for Paurus; Floyd G..The latest application filed is for "method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders".
Patent | Date |
---|---|
Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders Grant 5,504,993 - Szerlip , et al. April 9, 1 | 1996-04-09 |
Integrated decoupling capacitive core for a printed circuit board and method of making same Grant 5,469,324 - Henderson , et al. November 21, 1 | 1995-11-21 |
Memory stack with an integrated interconnect and mounting structure Grant 5,448,511 - Paurus , et al. September 5, 1 | 1995-09-05 |
Printed circuit board having integrated decoupling capacitive core with discrete elements Grant 5,428,499 - Szerlip , et al. June 27, 1 | 1995-06-27 |
Thermally conductive elastomeric interposer connection system Grant 5,273,439 - Szerlip , et al. December 28, 1 | 1993-12-28 |
Solid state memory device having optical data connections Grant 5,274,584 - Henderson , et al. December 28, 1 | 1993-12-28 |
Printed circuit board having an integrated decoupling capacitive element Grant 5,162,977 - Paurus , et al. November 10, 1 | 1992-11-10 |
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