Paul; Rituparna
Patent Applications and Registrations
Patent applications and USPTO patent grants for Paul; Rituparna.The latest application filed is for "moisture curable polyurethane hot melt adhesive composition having low levels of diisocyanate monomer".
- Paul; Rituparna - St. Paul MN
| Patent | Date |
|---|---|
| Moisture Curable Polyurethane Hot Melt Adhesive Composition Having Low Levels Of Diisocyanate Monomer App 20200407609 - Carlson; Brian W. ; et al. | 2020-12-31 |
| Reactive adhesive with enhanced adhesion to metallic surfaces Grant 9,957,427 - Carlson , et al. May 1, 2 | 2018-05-01 |
| Reactive film adhesives with enhanced adhesion to metallic surfaces Grant 9,944,834 - Carlson , et al. April 17, 2 | 2018-04-17 |
| Tacky, heat curable multi-layer adhesive films Grant 9,481,814 - Muvundamina , et al. November 1, 2 | 2016-11-01 |
| Reactive Film Adhesives With Enhanced Adhesion To Metallic Surfaces App 20160168423 - Carlson; Brian W. ; et al. | 2016-06-16 |
| Reactive Adhesive With Enhanced Adhesion To Metallic Surfaces App 20160168434 - Carlson; Brian W. ; et al. | 2016-06-16 |
| Heat Curable Adhesive Film App 20160046775 - MAI; FELIX D. ; et al. | 2016-02-18 |
| Tacky, Heat Curable Multi-layer Adhesive Films App 20150240128 - Muvundamina; Mutombo J. ; et al. | 2015-08-27 |
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