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Patent applications and USPTO patent grants for Paul; Jens.The latest application filed is for "novel pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure".
Patent | Date |
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Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure Grant 8,957,524 - Breuer , et al. February 17, 2 | 2015-02-17 |
Novel Pillar Structure For Use In Packaging Integrated Circuit Products And Methods Of Making Such A Pillar Structure App 20140264890 - Breuer; Dirk ;   et al. | 2014-09-18 |
Arrangement for reducing stress in substrate-based chip packages Grant 7,180,162 - Paul , et al. February 20, 2 | 2007-02-20 |
Arrangement for reducing stress in substrate-based chip packages App 20050017354 - Paul, Jens ;   et al. | 2005-01-27 |
Electrical component with a contact and method for forming a contact on a semiconductor material Grant 6,791,349 - Nagel , et al. September 14, 2 | 2004-09-14 |
Electrical component with a contact and method for forming a contact on a semiconductor material App 20030184333 - Nagel, Detlef ;   et al. | 2003-10-02 |
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