Pau; Stanley K. H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pau; Stanley K. H..The latest application filed is for "chip-to-chip optical interconnection using high refractive index couplers".

Company Profile

4.4.7

Pau; Stanley K. H. - Tucson AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High-throughput manufacturing of photonic integrated circuit (PIC) waveguides using multiple exposures Grant 11,454,759 - Jiang , et al. September 27, 2	2022-09-27
Chip-to-chip Optical Interconnection Using High Refractive Index Couplers App 20220244458 - Koch; Thomas L. ; et al.	2022-08-04
Fabrication of optical interconnect structures for a photonic integrated circuit Grant 11,402,752 - Koch , et al. August 2, 2	2022-08-02
Optical printed circuit board with polymer array stitch Grant 11,327,225 - Koch , et al. May 10, 2	2022-05-10
Assembly Of Flexible Optical Waveguides And Photonic Chips For Optical Interconnection Packaging App 20220105695 - JIANG; Linan ; et al.	2022-04-07
Fabrication of polymer waveguide interconnect between chips with a gap and/or step Grant 11,275,208 - Jiang , et al. March 15, 2	2022-03-15
Fabrication Of Polymer Waveguide Interconnect Between Chips With A Gap And/or Step App 20210373236 - JIANG; Linan ; et al.	2021-12-02
High-throughput Manufacturing Of Photonic Integrated Circuit (pic) Waveguides Using Multiple Exposures App 20200379175 - JIANG; Linan ; et al.	2020-12-03
Imaging Method And Apparatus Using Circularly Polarized Light App 20200275078 - PAU; Stanley K.H.	2020-08-27
Optical Printed Circuit Board With Polymer Array Stitch App 20190098751 - KOCH; Thomas L. ; et al.	2019-03-28
Fabrication Of Optical Interconnect Structures For A Photonic Integrated Circuit App 20180314151 - KOCH; THOMAS L. ; et al.	2018-11-01

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