PATTON; Evan E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for PATTON; Evan E..The latest application filed is for "method for coating surfaces".

Company Profile

0.31.5

PATTON; Evan E. - Pleasanton CA
Patton; Evan E. - Portland OR
Patton; Evan E - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Coating Surfaces App 20160254125 - HUANG; Lihua Li ; et al.	2016-09-01
Sequential station tool for wet processing of semiconductor wafers Grant 8,883,640 - Patton , et al. November 11, 2	2014-11-11
Sequential station tool for wet processing of semiconductor wafers Grant 8,450,210 - Patton , et al. May 28, 2	2013-05-28
Process For Electroplating Metals Into Microscopic Recessed Features App 20120279864 - Mayer; Steven T. ; et al.	2012-11-08
Process for electroplating metals into microscopic recessed features Grant 8,048,280 - Mayer , et al. November 1, 2	2011-11-01
Sequential station tool for wet processing of semiconductor wafers Grant 8,026,174 - Patton , et al. September 27, 2	2011-09-27
Sensor for measuring liquid contaminants in a semiconductor wafer fabrication process Grant 7,696,538 - Lee , et al. April 13, 2	2010-04-13
Methods and apparatus for controlled-angle wafer positioning Grant 7,686,927 - Reid , et al. March 30, 2	2010-03-30
Sequential station tool for wet processing of semiconductor wafers Grant 7,189,647 - Patton , et al. March 13, 2	2007-03-13
Methods and apparatus for controlled-angle wafer positioning Grant 7,097,410 - Reid , et al. August 29, 2	2006-08-29
Liquid detection end effector sensor and method of using the same App 20060169977 - Lee; Won ; et al.	2006-08-03
Liquid detection end effector sensor and method of using the same Grant 7,084,466 - Lee , et al. August 1, 2	2006-08-01
Clamshell apparatus with crystal shielding and in-situ rinse-dry Grant 7,033,465 - Patton , et al. April 25, 2	2006-04-25
Process for electroplating metals into microscopic recessed features App 20060011483 - Mayer; Steven T. ; et al.	2006-01-19
Sequential station tool for wet processing of semiconductor wafers App 20050282371 - Patton, Evan E. ; et al.	2005-12-22
Methods and apparatus for controlling electrolyte flow for uniform plating Grant 6,964,792 - Mayer , et al. November 15, 2	2005-11-15
Process for electroplating metal into microscopic recessed features Grant 6,946,065 - Mayer , et al. September 20, 2	2005-09-20
Copper electroplating method and apparatus Grant 6,890,416 - Mayer , et al. May 10, 2	2005-05-10
Clamshell apparatus for electrochemically treating wafers Grant 6,800,187 - Reid , et al. October 5, 2	2004-10-05
Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sources Grant 6,773,571 - Mayer , et al. August 10, 2	2004-08-10
Clamshell apparatus with dynamic uniformity control Grant 6,755,946 - Patton , et al. June 29, 2	2004-06-29
Electroplating process chamber and method with pre-wetting and rinsing capability Grant 6,716,334 - Reid , et al. April 6, 2	2004-04-06
Apparatus for electroplating copper onto semiconductor wafer Grant 6,589,401 - Patton , et al. July 8, 2	2003-07-08
Methods and apparatus for controlled-angle wafer immersion Grant 6,551,487 - Reid , et al. April 22, 2	2003-04-22
Copper electroplating apparatus Grant 6,527,920 - Mayer , et al. March 4, 2	2003-03-04
Clamshell apparatus for electrochemically treating semiconductor wafers Grant 6,436,249 - Patton , et al. August 20, 2	2002-08-20
Electroplating process including pre-wetting and rinsing Grant 6,214,193 - Reid , et al. April 10, 2	2001-04-10
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer Grant 6,162,344 - Reid , et al. December 19, 2	2000-12-19
Clamshell apparatus for electrochemically treating semiconductor wafers Grant 6,156,167 - Patton , et al. December 5, 2	2000-12-05
Method of depositing metal layer Grant 6,139,712 - Patton , et al. October 31, 2	2000-10-31
Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer Grant 6,110,346 - Reid , et al. August 29, 2	2000-08-29
Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability Grant 6,099,702 - Reid , et al. August 8, 2	2000-08-08
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer Grant 6,074,544 - Reid , et al. June 13, 2	2000-06-13
Method and apparatus for active pyrometry Grant 5,029,117 - Patton July 2, 1	1991-07-02
Method of fabricating a semiconductor device using a tri-layer structure and conductive sidewalls Grant 4,994,400 - Yamaguchi , et al. February 19, 1	1991-02-19

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